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A Study on Competitiveness of Taiwan’s Semiconductor Packaging & Testing Business

최병헌
국제학연구소 (The Keimyung Institute for International Studies)|2023.06|국제학논총 (JOURNAL OF INTERNATIONAL STUDIES)|제37권 |pp. 105-133|DOI 10.22971/jois.37..202306.105

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키워드

TSMCTaiwan semiconductor industryIC packaging & testingOSATASE Technology대만 반도체 산업반도체 패키징 및 테스팅ASE 테크놀로지

초록

Taiwan’s semiconductor packaging & testing business has been a labor intensive one, so it employs much more workforce than the fabless or manufacturing business. It leads to a low added value of labor. However, the advanced packaging & testing are already managed as critical methods in figuring out the physical restriction of micro-process innovation. This study tries to analyze how can Taiwan's IC packaging & testing business keeps a global ccompetitiveness by dealing with a low added value issue. As a result of analysis, the first finding is that ASE Technology was able to expand the global market share and the revenue size by merging the SPIL in 2018. It could get a cost leadership for packaging & testing through the economies of scale. Secondly, the TSMC is to take an initiative for advanced packaging through the 3D Fabric alliance within the open innovation platform because it covers many global leading partners. Such a linkage has enough value to be said a significant differentiation factor of Taiwan’s IC packaging & testing business. Therefore, both the economies of scale by ASE Technology and the open innovation platform by TSMC are key sources of the competitiveness.

Abstract

Taiwan’s semiconductor packaging & testing business has been a labor intensive one, so it employs much more workforce than the fabless or manufacturing business. It leads to a low added value of labor. However, the advanced packaging & testing are already managed as critical methods in figuring out the physical restriction of micro-process innovation. This study tries to analyze how can Taiwan's IC packaging & testing business keeps a global ccompetitiveness by dealing with a low added value issue. As a result of analysis, the first finding is that ASE Technology was able to expand the global market share and the revenue size by merging the SPIL in 2018. It could get a cost leadership for packaging & testing through the economies of scale. Secondly, the TSMC is to take an initiative for advanced packaging through the 3D Fabric alliance within the open innovation platform because it covers many global leading partners. Such a linkage has enough value to be said a significant differentiation factor of Taiwan’s IC packaging & testing business. Therefore, both the economies of scale by ASE Technology and the open innovation platform by TSMC are key sources of the competitiveness.

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