Effect of Localized Recrystallization Distribution on Edgebond and Underfilm Applied Wafer-level Chip-scale Package Thermal Cycling Performance
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초록
The correlation between crack propagation and localized recrystallization are compared in a series of crosssection analyses on thermal cycled edgebond and underfilm material applied wafer level chip scale package (WLCSP)components with a baseline of no-material applied WLCSP components. The results show that the crack propagation distributionand recrystallization region correlation can explain potential degradation mechanisms and support the damageaccumulation history in a more efficient way. Edgebond material applied components show a shift of damage accumulationto a more localized region, thus potentially accelerated the degradation during thermal cycling. Underfilm material appliedcomponents triggered more solder joints for a more wider distribution of damage accumulation resulting in a slightlyimproved thermal cycling performance compared to no-material applied components. Using an analysis on localized distributionof recrystallized areas inside the solder joint showed potential value as a new analytical approach.
Abstract
The correlation between crack propagation and localized recrystallization are compared in a series of crosssection analyses on thermal cycled edgebond and underfilm material applied wafer level chip scale package (WLCSP)components with a baseline of no-material applied WLCSP components. The results show that the crack propagation distributionand recrystallization region correlation can explain potential degradation mechanisms and support the damageaccumulation history in a more efficient way. Edgebond material applied components show a shift of damage accumulationto a more localized region, thus potentially accelerated the degradation during thermal cycling. Underfilm material appliedcomponents triggered more solder joints for a more wider distribution of damage accumulation resulting in a slightlyimproved thermal cycling performance compared to no-material applied components. Using an analysis on localized distributionof recrystallized areas inside the solder joint showed potential value as a new analytical approach.
참고문헌 (11)
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