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Chemically Bonded Thermally Expandable Microsphere-silica Composite Aerogel with Thermal Insulation Property for Industrial Use

김종일|박형호|문승환|최하령|이규연|Varsha D. Phadtare|배영광
한국마이크로전자및패키징학회 (The Microelectronics And Packaging Society)|2019.06|마이크로전자 및 패키징학회지 (Jornal of the Microelectronics and Packaging Society)|제26권 제2호|pp. 23-29

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키워드

compositesaerogelorganic-inorganicThermally expandable microsphereinsulator
주제분류재료공학

초록

Thermally expandable microsphere and aerogel composite was prepared by chemical compositization. Microsphere can produce synergies with aerogel, especially an enhancement of mechanical property. Through condensation between sulfonated microsphere and hydrolyzed silica sol, chemically-connected composite aerogel could be prepared. The presence of hydroxyl group on the sulfonated microsphere was observed, which was the prime functional group of reaction with hydrolyzed silica sol. Silica aerogel-coated microsphere was confirmed through microstructure analysis. The presence of silicon-carbon absorption band and peaks from composite aerogel was observed, which proved the chemical bonding between them. A relatively low thermal conductivity value of 0.063 W/m·K was obtained.

Abstract

Thermally expandable microsphere and aerogel composite was prepared by chemical compositization. Microsphere can produce synergies with aerogel, especially an enhancement of mechanical property. Through condensation between sulfonated microsphere and hydrolyzed silica sol, chemically-connected composite aerogel could be prepared. The presence of hydroxyl group on the sulfonated microsphere was observed, which was the prime functional group of reaction with hydrolyzed silica sol. Silica aerogel-coated microsphere was confirmed through microstructure analysis. The presence of silicon-carbon absorption band and peaks from composite aerogel was observed, which proved the chemical bonding between them. A relatively low thermal conductivity value of 0.063 W/m·K was obtained.

참고문헌 (34)

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