플립칩 패키지 BGA의 전단강도 시험법 표준화
Regulation in Shear Test Method for BGA of Flip-chip Packages
2
조회
0
다운로드
16
인용
0
참고문헌
초록
We reported the methodology for the shear test which is one of the evaluation procedure for mechanical reliability of flip-chip package. The shear speed and the tip height are found to be two significant experimental parameters in the shear test. We investigated how these two parameters have an influence on the results, the shear strength and failure mode. In order to prove these experimental inconsistency, simulation using finite element analysis was also conducted to calculate the shear strength and to figure out the distribution of plastic energy inside of the solder ball. The shear strength decreased while the tip height increased or the shear speed decreased. A variation in shear strength due to inconsistent shear conditions made confusion on analyzing experimental results. As a result, it was strongly needed to standardize the shear test method.
Abstract
We reported the methodology for the shear test which is one of the evaluation procedure for mechanical reliability of flip-chip package. The shear speed and the tip height are found to be two significant experimental parameters in the shear test. We investigated how these two parameters have an influence on the results, the shear strength and failure mode. In order to prove these experimental inconsistency, simulation using finite element analysis was also conducted to calculate the shear strength and to figure out the distribution of plastic energy inside of the solder ball. The shear strength decreased while the tip height increased or the shear speed decreased. A variation in shear strength due to inconsistent shear conditions made confusion on analyzing experimental results. As a result, it was strongly needed to standardize the shear test method.
참고문헌 (93)
- S. Y. Oh, "Electronic Packaging Technology Roadmap", pp.5~80 (2009), Korea Microelectronics and Packaging Society
- K. S. Kim, "Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching", J. Kor. Inst. Met.& Mater.
- 이 종 현, "저온용 무연솔더 조성 개발의 필요성과 대표 조성의 특성", 대한용접접합학회지, 24(2), pp.17~28 (2006), 대한용접접합학회
- J. W. Kim, "Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints", Materials Science and Engineering A, 371(1), pp.267~ (2004)
- S. S. Ha, "Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package", Microelectronic Engineering, 87(3), pp.57~ (2010)
- J. W. Kim, "Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test", J. Mater. Sci. : Materials in electronics, 20(1), pp.17~ (2009)
- E. Kaulfersch, "Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations", proc. 8th Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems (Euro- SimE), pp.1~4 (2007), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- J. W. Kim, "Optimization of shear test for flip chip solder bump using 3-dimensional computer simulation", Microelectronic Engineering, 82(3), pp.551~ (2005)
- "JEDEC Standard JESD22-B117A, Solder ball shear", ~ (2006)
- J. W. Kim, "Characterization of the shear test method with low melting point In-48Sn solder joints", Materials Science and Engineering A, 397(1), pp.145~ (2005)
- J. W. Kim, "Optimization of the shear test method for flip chip solder bump. in Spring Conference of KWS", Journal of KWS, pp.18~ (2006)
- 주진원, "Flip Chip PBGA 패키지의 온도변화에 대한 변형거동 해석", 마이크로전자 및 패키징학회지, 13(4), pp.17~26 (2006), 한국마이크로전자및패키징학회
- 장진규, "고속전단 시험을 이용한 Sn-37Pb BGA solder joints의 기계적 신뢰성 특성 평가", 마이크로전자 및 패키징학회지, 15(4), pp.65~70 (2008), 한국마이크로전자및패키징학회
- H. Tsukamoto, "Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni(P)", Au surface-finished substrates, 2010, pp.171(1), 162~
- 김종웅, "Failure Mechanism of Pb-Bearing and Pb-Free Solder Joints under High-Speed Shear Loading", Metals and Materials International, 16(1), pp.7~12 (2010), 대한금속·재료학회
- E. P. Leng, "BGA lead-free C5 solder system improvement by Germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy", Proc. 11th Electronics Packaging Technology Conference (EPTC), pp.82~ (2009), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- Ni metallized Cu pads, "Effect of nano Al2O3 addition on the microstructure, hardenss and shear strength of eutectic Sn-9Zn solder on Au", T. Fouzder
- S. S. Ha, "Influence of current density on mechanical reliability of Sn-3.5Ag BGA solder joint", Microelectronic Engineering
- L. Nie, "Temperature cycling reliability of reballed and reworked ball grid array packages in SnPb and SAC assembly", 박사, pp.2010
- H. J. Lin, "Effect of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag- 0.5Cu solder joints", J. Alloys Compd, 500(2), pp.167~ (2010)
- H. J. Lin, "Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish", Microelectronics Reliability
- Y. Y. Shiue, "Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au", Ni, J. Alloys Compd, pp.2010, 491(1)[DOI]
- S. J. Jo, "Improvement of the solder joint strength in a SAC solder ball to a ENIG substrate using LF hydrogen radical treatment", Proc. 60th Electronic Components and Technology Conference (ECTC), pp.1752~ (2010), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- S. W. Chuung, "Investigation of Pb-free solder interconnect under drop impact by ball pull and shear tests", Proc. 60th Electronic Components and Technology Conference (ECTC), pp.916~ (2010), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- Y. Zhang, "The experimental and numerical investigation on shear behaviour of solder ball in a wafer level chip scale package", Proc. 60th Electronic Components and Technology Conference (ECTC), pp.1746~ (2010), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- K. J. Wang, "Impact testing of Sn-3.0Ag-0.5Cu solder with Ti", Ni(V), Journal of Electronic Materials[DOI]
- W. H. Wu, "Influence of palladium thickness on the soldering reactions between Sn- 3Ag-0.5Cu and Au", Pd(P), Journal of Electronic Materials[DOI]
- A. K. Gain, "Investigation of small Sn-3.5Ag-0.5Cu additions on the microstructure and propertie of Sn-8Zn-3Bi solder on Au", Ni, J. Alloys Compd, pp.2010, 489(2)[DOI]
- S. S. Ha, "Mechanical property evaluation of Sn-3.0Ag-0.5Cu BGA solder joints using highspeed ball shear test", Journal of Electronic Materials, 38(12), pp.2489~ (2009)
- W. H. Bang, "Fracture mechanics of solder bumps during ball shear testing: effect of bump size", Journal of Electronic Materials, 38(9), pp.1896~ (2009)
- M. O. Alam, "Fracture mechanics analysis of solder joint intermetallic compounds in shear test", Computational Materials Science, 45(2), pp.576~ (2009)
- K. S. Lin, "Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au", Ni surface finish during reflow reaction, 2009, pp.471(1), 291~
- J. W. Yoon, "Interfacial reaction and mechanical reliability of eutectic Sn-0.7Cu", immersion Ag-plated Cu solder joint, 2009, pp.25(12), 1478~
- A. K. Gain, "Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages", Microelectronics Reliability, 49(7), pp.746~ (2009)
- A. K. Gain, "Effect of small Sn-3.5Ag-0.5Cu addition on the structure annd properties of Sn-9Zn solder in ball grid array packages", Microelectronic Engineering, 86(11), pp.2347~ (2009)
- P. Liu, "Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SuPb solder joints with different PCB surface finishes", J. Alloys Compd, 470(1), pp.188~ (2009)
- C. C. Jain, "Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish", Journal of Chinese Institute of Engineers, 32(2), pp.229~ (2009)
- P. Yao, "Interfacial reaction and shear strength of SnAgCu-xNi", Ni solder joints during aging at 150, 2009, pp.86(10), 1969~
- P. Yao, "Evolutions of the interface and shear strength of SnAgCu-xNi solder and Cu substrate during aging at 150", J. Alloys Compd, 468(1), pp.474~ (2009)
- T. H. Chuang, "Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finished", Journal of Materials Engineering and Performance, 18(8), pp.1133~ (2009)
- C. Y. Tan, "Characterization of the effect of shape memory alloy on solder joint strength through modeling and testing", Journal of Electronic Materials, 38(12), pp.2496~ (2009)
- C. N. Peng, "Reaction mechanism and mechanical properties of the flip-chip Sn-3.0Ag-0.5Cu solder bummp with Cu", Ni-xCu, Journal of Electronic Materials, pp.2009, 38(12)[DOI]
- E. H. Wong, "Advances in the drop-impact reliability of solder joints for mobile applications", Microelectronics Reliability, 49(2), pp.139~ (2009)
- S. K. Das, "Effect of Ag micro-particles content on the mechanical strength of the interfacial formed between Sn-Zn binary solder and Au", Ni, Microelectonic Engineering, pp.2009, 86(10)[DOI]
- X. Gu, "The shearing behavior and microstructure of Sn-4Ag-0.5Cu solder joints on a Ni- P-carbon nanotubes composite coating", J. Alloys Compd, 468(1), pp.553~ (2009)
- M. S. Yeh, "Mechanical properties of ternary Sn- In-Ag ball-grid array assemblies at ambient and elevated temperatures", Journal of Materials Engineering and Performance, 18(8), pp.1073~ (2009)
- S. Y. Chang, "Mechanical property and fracture behavior characterizations of 96.5Sn-3.0Ag- 0.5Cu solder joints", J. Alloys Compd, 490(1), pp.508~ (2009)
- A. K. Gain, "Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn- Zn-3Bi solders in Au", Ni, Materials Science and EngineeringB, pp.2009, 162(2)[DOI]
- I. Y. Jung, "Wetting properties and interfacial reactions of mechanically alloyed Cu5Zn8-bearing Pb-free solders on a copper substrate", Journal of Electronic Materials, 38(11), pp.2301~ (2009)
- M. G. Cho, "Interfacial reactions and microstructures of Sn-0.7Cu-xZn solders with Ni-P UBM during thermal aging", Journal of Electronic Materials, 38(11), pp.2242~ (2009)
- K. J. Wang, "Shear and pull testing of Sn-3.0Ag- 0.5Cu solder with Ti", Ni(V), Journal of Electronic materials, pp.2009, 38(12)[DOI]
- J. Shen, "Effects of ZrO2 nanoparticles on the mechanical properties of Sn-Zn solder joints on Au", Ni, J. Alloys Compd, pp.2009, 477(1)[DOI]
- E.H. Wong, "Correlation studies for component level ball impact shear test and board level drop test", Microelectronics Reliability, 48(7), pp.1069~ (2008)
- Haeng-UnSong, "Correlation between internal derangement and osteoarthrosis in the temporomandibular joint using magnetic resonance imaging", 대한구강악안면방사선학회지, 32(4), pp.6~225 (2002), 대한구강악안면방사선학회
- J. S. Lee, "Effects of Co addition in eutectic Sn-3.5Ag sol der on shear strength and microstructural development", Microelectronic Engineering, 85(7), pp.1577~ (2008)
- J. W. Kim, "Effect of high-speed loading conditions on the fracture mode of the BGA solder joint", Microelectronics Reliability, 48(11), pp.1882~ (2008)
- J. W. Yoon, "Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu", OSPfinished Cu CSP solder joint, 2008, pp.48(11), 1864~
- J. M. Koo, "Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages", Microelectronics Reliability, 483, pp.620~ (2008)
- T. C. Chai, "Angled high strain rate shear testing for SnAgCu solder balls", Proc. 58th Electronic Components and Technology Conference (ECTC), pp.623~ (2008), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- C. H. Fu, "Evaluation of new substrate surface finish: Electroless nickel", electroless palladium, Proc. 58th Electronic Components and Technology Conference (ECTC), pp.2008[DOI]
- D. Xie, "A new method to evaluate BGA pad cratering in lead-free soldering", Proc. 58th Electronic Components and Technology Conference (ECTC), pp.893~ (2008), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- X. J. Wang, "Effect of displacement rate on lap shear test of SAC solder ball joints", proc. International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), pp.1~4 (2008), IEEE Components, Packaging and Manufacturing Technology Society
- W. Sun, "Study of five substrate pad finishes for the co-design of solder joint reliability under board-level drop and temperature cycling test conditions", proc. International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), pp.1~8 (2008), IEEE Components, Packaging and Manufacturing Technology Society
- F. M. Nor, "Damage Mechanics Model for Interface Fracture Process in Solder Interconnects", proc. 10th Electronics Packaging Technology Conference (EPTC), pp.821~ (2008), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- T. S. Wang, "The microstructure and fracture behavior of Sn-3Ag-0.5Cu solder joints", proc. Electronic Materials and Packaging (EMAP), pp.293~ (2008), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- C. Y. Lin, "Mechanical behavior of lead-free solder joints under high speed shear test at different pad metallization substrate", proc. Electronic Materials and Packaging (EMAP), pp.120~ (2008), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- C. W. Lee, "The Investigation of Intermetallic Compound Morphology Effect on the Solder Joint Performance", proc. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPCT), pp.263~ (2008), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- C. N. Peng, "Mechanical test after temperature cycling on lead-free Sn-3Ag-0.5Cu solder joint", proc. International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), pp.1~4 (2008), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- M. C. Yew, "Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis", Microelectronics Reliability, 47(9), pp.1658~ (2007)
- J. M. Koo, "Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging", Microelectronics Reliability, 47(12), pp.2169~ (2007)
- Y. S. Lai, "Evaluation of solder joint strengths under ball impact test", Microelectronics Reliability, 47(12), pp.2179~ (2007)
- C. L. Yeh, "Empirical correlation between package-level ball impact test and boardlevel drop reliability", Microelectronics Reliability, 47(7), pp.1127~ (2007)
- J. W. Yoon, "Solder joint reliability evaluation of Sn-Zn", Au, Cu ball-grid-array package during aging, pp.Materials Science and Engineering: A, 2007[DOI]
- D. G. Kim, "Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints", J. Alloys compd, 458(1), pp.253~ (2008)
- P. Yao, "Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu–xNi composite solder joints on electrolytic Ni", Au metallized substrate, 2008, pp.462(1), 73~
- C. K. Wong, "The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging", Microelectronics Reliability, 48(4), pp.611~ (2008)
- J. W. Yoon, "Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu", OSPfinished Cu CSP solder joint, 2008, pp.48(11), 1864~
- J. W. Yoon, "Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn- 3.5Ag-0.7Cu solder joint", J. Alloys compd., 458(1), pp.200~ (2008)
- J. W. Yoon, "Mechanical reliability of Sn-rich Au- Sn", Ni flip chip solder joints fabricated by sequential electroplating method, 2008, pp.48(11), 1857~
- J. W. Kim, "Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process", Materials Science and Engineering: A, 452, pp.2267~ (2007)
- J. M. Koo, "Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging", Microelectronics Reliability, 47(12), pp.2169~ (2007)
- S. S. Ha, "Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method", Microelectronic Engineering, 84(11), pp.2640~ (2007)
- A. Sharif, "Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints", Microelectronic Engineering, 84(2), pp.328~ (2007)
- J. W. Yoon, "Solder joint reliability evaluation of Sn–Zn", Au, Cu ball-grid-array package during aging, pp.Materials Science and Engineering: A, 2007[DOI]
- Y. H. Lee, "Shear strength and interfacial microstructure of Sn-Ag-xNi", Cu single shear lap solder joints, 2007, pp.444(1), 75~
- J. Y. H. Chia, "The specific work of fracture in ball shear test and the integrity of solder balls", Materials Science and Engineering: A, 428(1), pp.67~ (2006)
- J. W. Kim, "Reexamination of the solder ball shear test for evaluation of the mechanical joint strength", Int. J. Solids Structures, 43(7), pp.1928~ (2006)
- J. Y. H. Chia, "The mechanics of the solder ball shear test and the effect of shear rate", Materials Science and Engineering: A, 417(1), pp.259~ (2006)
- J. W. Yoon, "Reliability studies of Sn-9Zn", Cu solder joints with aging treatment, 2006, pp.407(1), 141~
- P. C. Shih, "Interfacial microstructure and shear behavior of Sn–Ag-Cu solder balls joined with Sn–Zn–Bi paste", J. Alloys compd, 422(1), pp.153~ (2006)
- J. W. Yoon, "High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu", Ni solder joints during isothermal aging, 2006, pp.46(5), 905~
- W. M. Chen, "Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders", Microelectronics and Reliability, 46(5), pp.896~ (2006)
- J. W. Kim, "Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application", Microelectronics Reliability, 46(2), pp.535~ (2006)
