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전력반도체 패키징을 위한 Transient liquid phase 접합 기술

Trasient Liquid Phase bonding for Power Semiconductor

김원중|정재필|노명훈|Hiroshi Nishikawa
한국마이크로전자및패키징학회 (The Microelectronics And Packaging Society)|2017.03|마이크로전자 및 패키징학회지 (Jornal of the Microelectronics and Packaging Society)|제24권 제1호|pp. 27-34

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키워드

shear strengthPower semiconductorTLP bondingPb-freemcirostructure
주제분류재료공학

초록

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

Abstract

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

참고문헌 (35)

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