Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging
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Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electricalinterconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachiningto create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deepUV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs withhigh hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30to 100 μm thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling ofTGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality andcan readily achieve future-proof TGV diameters as small 10 μm together with a corresponding reduction in pitch size.
Abstract
Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electricalinterconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachiningto create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deepUV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs withhigh hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30to 100 μm thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling ofTGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality andcan readily achieve future-proof TGV diameters as small 10 μm together with a corresponding reduction in pitch size.
참고문헌 (7)
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