펨토초 레이저 어블레이션을 이용한 Si 웨이퍼의 미세 관통 홀 가공
Femto-second Laser Ablation Process for Si Wafer Through-hole
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초록
본 논문에서는 펨토초 레이저가 정밀하고 효과적인 레이저 어블레이션 작업이 가능한지를 확인하기위해 Si 재료 내부의 열전달 메커니즘에 대한 수치해석을 실시하였으며, Si 웨이퍼에 각각 다른 조건으로 적용된 레이저 플루언스 값으로 100㎛ 직경의 미세 관통 홀을 형성한 후, 광학현미경과 3차원 표면 형상 측정 장비를 사용하여 형성된 미세 관통 홀의 가공성과 열영향부의 발생 정도를 관찰하고 분석하였다. 레이저 플루언스 조건에 따른 열영향부의 발생 정도를 분석한 실험 결과를 통해, 최소한의 열영향부를 가지며 우수한 홀 가공성을 보이는 최적의 미세 관통 홀 가공 조건을 도출하였다.
Abstract
The main objectives of this study are to investigate the micro-scale energy transfer mechanism for silicon wafer and to find an efficient way for fabrication of silicon wafer through-hole by using the femtosecond pulse laser ablation. In addition, the electron-phonon interactions during laser irradiation are discussed and the carrier number density and temperatures are estimated. In particular, the present study observes the shapes of silicon wafer through-hole with 100m diameter and it also measures the heat-affected area and the ablation depths for different laser fluences by using the optic microscope and the three-dimensional profile measurement technique. First, from numerical investigation, it is found that the nonequilibrium state exists between electrons and phonons during laser irradiation. From experimental results, it should be noted that the heat-affected area increases with laser fluence, and the optimal conditions for through-hole formation with minimum heat affected zone are finally obtained.
참고문헌 (9)
- "Trends in microelectronics packaging and interconnection", A1 (1996)
- "Introduction to microsystems packaging", pp.4~26 (2001), McGraw-Hill
- "SOP : What is it and why? a new microsystem integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade", 27(2), pp.241~ (2004)
- "Architectural implications and process development of 3-D VLSI z-axis interconnects using through silicon vias", 28(3), pp.356~ (2005)
- "Three-dimensional system-in-package using stacked silicon platform technology", 28(3), pp.377~ (2005)
- "Short-pulse laser ablation of solid targets", 129, pp.134~ (1996)
- "Microscale energy transport in solids", pp.89~92 (1997), Taylor & Francis
- "Nonequilibrium heat transfer characteristics during ultrafast pulse laser heating of a silicon microstructure", 19, pp.1427~ (2005)
- "Short-pulse laser heating on metals", international journal of heat and mass transfer(35), pp.719~ (1992)