펨토초 레이저의 싱글 모드 및 버스트 모드에 따른 Through Glass Via 가공 형상 및 기계적 특성에 대한 비교 분석
Comparison of Through Glass Via Machining Geometry and Mechanical Properties Using Single Mode and Burst Mode of Femtosecond Laser
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초록
최근, 2.5D 패키징 기술에서 사용되는 인터포저 기판의 소재를 유리로 한 연구가 활발히 진행되고 있다. 유리인터포저에 TGV (through glass via) 구조를 형성하기 위해 펨토초 레이저가 많이 활용되고 있으나, 펨토초 레이저로TGV를 가공하는 과정에서 발생하는 열 탄성파 및 충격파에 따른 대미지는 미세 간격의 비아를 형성하는 데 신뢰성을 저하시킬 수 있다. 패키징 신뢰성을 높이기 위해서는 가공 중에 대미지가 발생하지 않는 것이 중요하다. 따라서, 본 논문에서는 펨토초 레이저의 싱글 펄스가 분배되어 발진하는 버스트 모드를 이용하여 싱글 모드로 인해 비아 주변으로 발생할수 있는 대미지를 억제하면서 비아 간격을 줄이고, 나노인덴터를 통해 싱글 모드와 버스트 모드로 가공된 비아 주변의 기계적 특성을 분석하여 대미지가 발생하지 않는 원인과 탄성 계수의 관계에 대해 제시하고자 한다.
Abstract
Recently, there has been a lot of research into glass as a material for interposer substrates used in 2.5D packaging technologies. Femtosecond lasers have been widely used to form TGV (through glass via) structures on glass interposers. However, damage caused by thermoelastic waves and shock waves during the TGV fabrication process using femtosecond lasers can limit the formation of vias with fine pitch, making it crucial to minimize damage during processing the damage caused by thermoelastic and shock waves during the processing of TGVs with femtosecond lasers is a challenge in forming closely spaced vias. In this study, we propose to reduce the via spacing while suppressing the damage caused by the single mode to the around of the via by using the burst mode in which the single pulse of the femtosecond laser is distributed and oscillated, and to analyze the mechanical properties around the via processed by single mode and burst mode through nanoindenter to suggest that the reason for the damage is related to the elastic modulus.
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