Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes
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Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides abrief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, andtechniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy,are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solderparticle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creeprecovery behaviour of pastes.
Abstract
Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides abrief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, andtechniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy,are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solderparticle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creeprecovery behaviour of pastes.
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