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전자소자 열분석을 위한 열반사 현미경 기술

Thermoreflectance Microscopy for Thermal Analysis of Electronics

이승환|장혜진|김현범
한국마이크로전자및패키징학회 (The Microelectronics And Packaging Society)|2022.06|마이크로전자 및 패키징학회지 (Jornal of the Microelectronics and Packaging Society)|제29권 제2호|pp. 19-31|DOI https://dx.doi.org/10.6117/kmeps.2022.29.2.019

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키워드

thermographythermal managementthermoreflectancemicroscopymicroelectronics
주제분류재료공학

초록

최근 거대 데이터 기반의 미래 기술이 발전함에 따라 전자 소자의 고성능 및 고집적화 추세가 지속되고 있는데, 이는 심각한 발열 문제를 수반하여 소자의 신뢰성을 위협하는 주요 요인으로 작용하고 있다. 효과적인 열관리 대책을수립하기 위해서는 소자의 구동 환경에서 온도 분포를 정확히 평가하고 방열 경로를 설계하는 것이 필요하다. 본 논문에서는 소자의 온도 분포를 비접촉 방식의 높은 공간 및 시간 분해능으로 관찰할 수 있는 열반사 현미경 기술을 소개한다. 구체적으로 열반사 현미경의 원리 및 구동 형태를 알아보고, 온도, 공간, 시간 분해능 향상을 위한 최신 연구 동향과 다양한 전자 소자의 온도 및 열적 특성 분석에 적용된 사례를 함께 살펴본다.

Abstract

With the advent of technologies based on big data, the trend of electronics towards high performance and high integration density continues. However, this development of electronics suffers from overheating issues, which seriously threaten the reliability of the devices. To develop effective strategies for thermal management, it is crucial to accurately evaluate the temperature distribution and design the heat dissipation path within the device in the operating condition. This paper introduces thermoreflectance microscopy that can observe the temperature distribution of a device with high spatial and temporal resolutions in a non-contact way. Specifically, the working principle and various forms of thermoreflectance microscopy are presented along with the latest research trends to improve the temperature, space, and time resolutions. We further review several examples in which thermoreflectance microscopy is applied to investigate the temperature and thermal characteristics of electronic devices.

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