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유연신축성 전자 디바이스를 위한 열계면 소재 연구동향

Research Trends in Thermal Interface Materials for Flexible and Stretchable Electronic Device

김광석|정건주|박영주
한국마이크로전자및패키징학회 (The Microelectronics And Packaging Society)|2024.03|마이크로전자 및 패키징학회지 (Jornal of the Microelectronics and Packaging Society)|제31권 제1호|pp. 7-15|DOI doi.org/10.6117/kmeps.2024.31.1.007

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키워드

StretchabilityThermal managementThermal conductivityHeat dissipationThermal interface materialsFlexible and stretchable electronic device
주제분류재료공학

초록

유연신축성 전자 디바이스의 다기능화, 소형화 및 고출력화 추세에 따라 우수한 열 전달 특성을 갖춘 재료나구조가 이슈로 부상하고 있다. 기존의 열계면 소재는 급격한 구부림, 비틀림, 신축 등을 겪어야 하는 유연신축성 전자 디바이스의 방열 요구성능을 충족시키지 못한다. 이러한 문제를 해결하기 위하여 높은 열전도성과 신축성을 동시에 갖는열계면 소재 개발이 요구된다. 본 논문에서는 Liquid metal, Carbon, Ceramic 기반 신축성 열계면 소재의 연구동향을 살펴보고 열적, 기계적 특성 향상을 위한 효과적 전략을 알아보고자 한다.

Abstract

In the trend of the multi-functionalization, miniaturization, and increased power output trends of flexible and stretchable electronic devices, the development of materials or structures with superior heat transfer characteristics has become a pressing issue. Traditional thermal interface materials (TIM) fail to meet the heat dissipation requirements of flexible and stretchable electronic devices, which must endure rapid bending, twisting, and stretching. To address this challenge, there is a demand for the development of TIM that simultaneously possesses high thermal conductivity and stretchability. This paper examines the research trends of liquid metal, carbon, and ceramic-based stretchable thermal interface materials and explores effective strategies for enhancing their thermal and mechanical properties.

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