63Ni 밀봉선원용 Ni 전기도금 박막에서 Ni 농도가 잔류응력에 미치는 영향
Effects of Ni Concentration on Residual Stress in Electrodeposited Ni Thin Film for 63Ni Sealed Source
2
조회
0
다운로드
4
인용
0
참고문헌
키워드
초록
Chloride plating solution was fabricated by dissolving metal Ni powders in a mixed solution with HCl and de-ionized water. Effects of Ni2+ and saccharin concentrations in the plating baths on current efficiency, residual stress, surface morphology and microstructure of Ni films were studied. In the case of 0.2 M Ni2+ concentration, current efficiency was decreased to about 65 % with increasing saccharin concentration, but, in the case of 0.7 M Ni2+ concentration, it was shown more than 90 % with the increase of saccharin concentration. Residual stress of Ni thin film was appeared to be about 400 MPa up to 0.0244 M saccharin concentration at the 0.2 M Ni2+ concentration and surface morphology with severe cracks was observed in the range of 0.0487~0.0975 M saccharin concentration. Residual stress of Ni thin films was measured to be about 750 MPa without saccharin addition and 114~148 MPa at the range of 0.0097~0.0975 M saccharin concentration for the 0.7 M Ni2+ concentration. Relatively low residual stress values (114~148 MPa) of the Ni films at the range of 0.0097~0.0975 M saccharin concentration may be resulted from codeposition of S from saccharin. Ni films at 0.7 M Ni2+ concentration showed smooth surface morphology and were independent of saccharin concentration. Ni films at 0.7 M Ni2+ concentration consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks and the intensities of FCC(111) and FCC(200) peaks increased with increasing saccharin concentration. Also, the average grain size decreased with increasing saccharin concentration from about 30 nm to about 15 nm.
Abstract
Chloride plating solution was fabricated by dissolving metal Ni powders in a mixed solution with HCl and de-ionized water. Effects of Ni2+ and saccharin concentrations in the plating baths on current efficiency, residual stress, surface morphology and microstructure of Ni films were studied. In the case of 0.2 M Ni2+ concentration, current efficiency was decreased to about 65 % with increasing saccharin concentration, but, in the case of 0.7 M Ni2+ concentration, it was shown more than 90 % with the increase of saccharin concentration. Residual stress of Ni thin film was appeared to be about 400 MPa up to 0.0244 M saccharin concentration at the 0.2 M Ni2+ concentration and surface morphology with severe cracks was observed in the range of 0.0487~0.0975 M saccharin concentration. Residual stress of Ni thin films was measured to be about 750 MPa without saccharin addition and 114~148 MPa at the range of 0.0097~0.0975 M saccharin concentration for the 0.7 M Ni2+ concentration. Relatively low residual stress values (114~148 MPa) of the Ni films at the range of 0.0097~0.0975 M saccharin concentration may be resulted from codeposition of S from saccharin. Ni films at 0.7 M Ni2+ concentration showed smooth surface morphology and were independent of saccharin concentration. Ni films at 0.7 M Ni2+ concentration consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks and the intensities of FCC(111) and FCC(200) peaks increased with increasing saccharin concentration. Also, the average grain size decreased with increasing saccharin concentration from about 30 nm to about 15 nm.
참고문헌 (15)
- M. Petec, "Plating Nickel-63 on Copper Coupons", Chemical Technology Division, ~ (1989)
- S. D. Cooper, "Surrogate standards for the determination of individual polychlorinated biphenyls using highresolution gas chromatography with electron capture detection", Anal. Chem, 57, pp.2469~2473 (1985)
- M. Kumar, "An electrochemical method for the preparation of 63Ni source for the calibration of thermoluminescence dosimeter (TLD)", Appl. Rad. Isot, 67, pp.1042~1049 (2009)
- J.L. Steeb, "Nickel-63 Microirradiators and Applications", Ph.D., pp.2010
- 박근용, "금속분말 Ni을 용해 한 Chloride Bath로 도금된 니켈후막의 입자크기에 대한 전류밀도 영향", 한국자기학회지, 23(1), pp.12~17 (2013), 한국자기학회
- 윤필근, "금속 Ni 분말을 용해한 도금용액으로부터 전기도금 된 Ni 박막 특성에 미치는 도금조건의 영향", 한국표면공학회지, 48(3), pp.73~81 (2015), 한국표면공학회[DOI]
- D.-Y. Park, "Electrodeposited Ni1-xCox nanocrystalline thin films: structure-property relationships", J. Electrochem. Soc, 153, pp.C814~C821 (2006)
- J.W. Dini, "Electrodeposition-The Materials Science of Coatings and Substrates", pp.279~ (1993), Noyes Publ
- B.-Z. Lee, "Spontaneous growth mechanism of tin whiskers", Acta Mater, 46, pp.3701~3714 (1998)
- K.-N. Tu, "Electronic Thin Film Science for Electrical Engineers and Materials Scientists" (1992), Macmillan Publishing Company
- G. A. Di Bari, "Modern Electroplating", pp.139~199 (2000), Wiley-Interscience
- 박덕용, "Chloride Bath로부터 전기도금된 나노결정립 니켈 박막의 잔류응력 변화에 대한 연구", 전기화학회지, 14(3), pp.163~170 (2011), 한국전기화학회
- P. C. Crouch, , Trans. Institute of Metal Finishing, 61, pp.133~ (1983)
- R. Weil, "The origins of stress in electrodeposits plating", Plating, 57, pp.1231~1237 (1970)
- D.-Y. Park, "Stress changes of nanocrystalline CoNi thin films electrodeposited from chloride baths", Electrochem. Solid-State Lett, 8, pp.C23~C25 (2005)