무전해 구리 도금액에서 착화제가 접합력에 미치는 영향에 대한 고찰
Effect of Complexing Agents on Adhesion Strength between Electroless Copper Film and Ta Diffusion Barrier
0
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle’s salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studiedin crystal structural point of view.
Abstract
The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle’s salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studiedin crystal structural point of view.
참고문헌 (24)
- T. Osaka, , J. Electrochimica Acta, 51, pp.916~ (2005)
- Y. Lantasov, , Microelectronic Engineering, 50(1-4), pp.441~ (2000)
- Z. Wang, , Electrochemica Acta, 51(12), pp.2442~ (2006)
- 권오중, "구리 및 은 금속 배선을 위한 전기화학적 공정", Korean Chemical Engineering Research(HWAHAK KONGHAK), 47(2), pp.141~149 (2009), 한국화학공학회
- J. J. Kim, , J. Vac. Sci. Technol, B21(1), pp.33~ (2003)
- S. P. Chong, , Surf. Coat. Tech, 198(1-3), pp.287~ (2005)
- K. J. Park, , J. Electrochem. Soc, 158(9), pp.D541~ (2011)
- T. H. Lim, , J. Electrochem. Soc, 159(3), pp.D142~ (2011)
- J. P. O’Kelly, , Microelectronic Engineering, 50(1-4), pp.473~ (2000)
- Y. Shacham-Diamand, , Electrochemica Acta, 44(21-22), pp.3639~ (1999)
- J. Li, , Electrochemica Acta, 49(11), pp.1789~ (2004)
- J. Ge, , Thin Solid Films, 440(1-2), pp.198~ (2003)
- C. J. Chen, , Thin Solid Films, 370(1-2), pp.106~ (2000)
- L. J. van der Pauw, , Philips Res. Rep, 13, pp.1~ (1958)
- V. M. Hauk, "Residual Stress and Stress Relaxation", pp.117~ (1982), Plenum Press
- B. D. Cullity, "Elements of X-ray Diffraction", pp.435~ (2001), Prentice Hall
- G. O. Mallory, "Electroless Plating:Fundamentals and Applications" (1990), American Electroplaters and Surface Finishers Society
- C. R. Barrett, "The Principles of Engineering Materials" (1973), Prentice-Hall
- D. A. Porter, "Phase Transformations in Metals and Alloys", pp.112~ (1992), Chapman & Hall
- S. P. Kim, , Thin Solid Films, 322(1-2), pp.298~ (1998)
- G. K. Williamson, , ActaMetall, 1, pp.22~ (1953)
- Y. B. Guo, , Philosophical Magazine, 92, pp.3064~ (2012)
- F. Czerwinski, , J. Electrochem. Soc, 143(10), pp.3327~ (1996)
- A. Kumar, , J. Mat. Sci. Lett, 9, pp.1094~ (1990)