피에조를 이용한 초소형 단일 솔더볼 연결부의 전단 시험장치 개발
Development of a Shear Testing Machine for a Miniature Single Solder Ball Joint using Piezoelectric Loading Device
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초록
A miniature shear testing machine was designed and developed, adopting a piezoelectric actuator with mechanical advantage using 4 levers in order to investigate shear behavior of a small solder ball. The final output displacement was initially expected to be 2.88 mm without load resistance, considering the lever ratio of 24 and the piezo displacement of 0.12 mm with an exciting voltage of 10 V. However, the final plunger displacement Δυ can be expected as Δυ=2.88−3.04×10−4F as a function of piezoelectric force F due to the stiffness of various levers and connectors and piezo actuator. The shear behavior of lead-free solder ball in diameter of 760 μm was successfully investigated in a speed range of 2 mm/s~0.0035 mm/s using this designed device.
Abstract
A miniature shear testing machine was designed and developed, adopting a piezoelectric actuator with mechanical advantage using 4 levers in order to investigate shear behavior of a small solder ball. The final output displacement was initially expected to be 2.88 mm without load resistance, considering the lever ratio of 24 and the piezo displacement of 0.12 mm with an exciting voltage of 10 V. However, the final plunger displacement Δυ can be expected as Δυ=2.88−3.04×10−4F as a function of piezoelectric force F due to the stiffness of various levers and connectors and piezo actuator. The shear behavior of lead-free solder ball in diameter of 760 μm was successfully investigated in a speed range of 2 mm/s~0.0035 mm/s using this designed device.
참고문헌 (6)
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- Spall, Quasi-static and High Strain Rate Shear Strength Data for Electronic Solder Materials, "Field JE", Drop-Impact Research Project between Institute of Microelectronics, University of Singapore, and University of Cambridge, ~, pp.Interim Report No. SP 1113 (2002)
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