마그네틱 파우더 브레이크를 이용한 소형 진자형 충격시험기 개발
Development of a Miniature Pendular Type Impact Testing Machine Using a Magnetic Powder Brake
2
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 μm was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.
Abstract
A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 μm was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.
참고문헌 (6)
- E.H. Wong, "A Review of Board Level Solder Joints for Mobile Applications", Microelectronics Reliability, 48, pp.1747~1758 (2008)
- "JEDEC Standard JESD22-B111, Board level drop test method of components for handheld electronic products", ~ (2000)
- 김호경, "피에조를 이용한 초소형 단일 솔더볼 연결부의 전단 시험장치 개발", 한국윤활학회지, 26(1), pp.44~51 (2010), 한국윤활학회
- V. Sivasubramaniam, "A Study of the Shaer Response of a Lead-free Composite Solder by Experimental and Homogenization Techniques", J Electronic Mat, 38(10), pp.2122~2131 (2009)
- M. Date, "Ductile-to-brittle Transition in Sn-Zn Solder Joints Measured by Impact Test", Scripta Mater, 51, pp.641~645 (2004)
- Q.K Zhang, "Tensile and Fatigue Behavior of Aged Cu", Sn-4Ag Solder Joint, 2009, pp.38(6), 852~859
