마이크로 압입 크리프 시험기 개발 및 성능평가
Development and its Performance Evaluation of a Micro-Impression Creep Machine
0
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with an accuracy of sub-μm scale, and load-cell with an accuracy of mN scale in order to investigate creep behavior of small solder ball in diameter of less than 1 mm. Creep behavior of leadfree solder ball(Sn-3.0Ag-0.5Cu) in diameter of 760 μm was investigated in the stress range of 8 ~ 60 MPa and at 303 K~ 393 K. The applied load became decreased slightly and continuously in the creep rate of 10−4/s range during the current experiments. Also, the machine frame was so sensitive to the environmental temperature that nm scaled displacement recording was unstable according to the change in environmental temperature.
Abstract
A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with an accuracy of sub-μm scale, and load-cell with an accuracy of mN scale in order to investigate creep behavior of small solder ball in diameter of less than 1 mm. Creep behavior of leadfree solder ball(Sn-3.0Ag-0.5Cu) in diameter of 760 μm was investigated in the stress range of 8 ~ 60 MPa and at 303 K~ 393 K. The applied load became decreased slightly and continuously in the creep rate of 10−4/s range during the current experiments. Also, the machine frame was so sensitive to the environmental temperature that nm scaled displacement recording was unstable according to the change in environmental temperature.
참고문헌 (10)
- I. Dutta, "Effect of Thermo-mechanically Induced MicrostrucTural Coarsening on the Evolution of Creep Response of SnAg-based Microelectronic Solders", Mat.Sci.Eng.A, 410, pp.48~52 (2005)
- J. Villain, "Creep Behavior of Lead Free and Lead Containing Solder Materials at High Homologous Temperatures with Regard to Small Solder Volumes", Sensors and Actuators A, 99, pp.194~197 (2002)
- C.M.L.Wu et.al, "Properties of Lead-free Solder Alloys with Rare Earth(RE)Element Additions", Mat.Sci.Eng.R, 44, pp.1~44 (2004)
- D.H.Sastry, "Impression Creep Technique-An Overview", Mat.Sci.Eng.A, 409, pp.66~75 (2005)
- J.C.M.Li, "Impression Creep and Other Localized Tests", Mat.Sci.Eng.A, 322, pp.23~42 (2002)
- F. Yang, "Impression Creep of Sn3.5g Eutectic Alloy", Mat.Sci.Eng.A, 409, pp.87~92 (2005)
- R. Mahdudi, "Impression Creep Behavior of Leadfree Sn-5Sb Solder Alloy", Mat.Sci.Eng.A, 448, pp.287~293 (2007)
- D. Pan, "Miniaturized Impression Creep Testing of Ball Grid Array Solder Balls Attached to Microelectronic Packaging Substrates", Rev.Sci.Inst, 75(12), pp.5244~5252 (2004)
- Ho-Kyung Kim, "Elevated Temperature Deformation Behavior in an AZ31 Magnesium Alloy", Journal of Mechanical Science and Technology, 20(8), pp.1209~1216 (2006), 대한기계학회
- W.D.Nix, "Mechanisms of Time Dependent Flow and Fracture of Metals", Stanford University, ~ (1993)