Design of RF CMOS Transceiver for Wireless Data Communication of Three-Dimensional Integrated Circuit Applications
1
조회
0
다운로드
0
인용
0
참고문헌
초록
In this study, a wireless type of chip-to-chip communication(WCC) technology is proposed as the next generation of three-dimensional(3D) semiconductor technology. To demonstrate the feasibility of the technology, we design a transceiver and receiver for wireless chip-to-chip communication method. The transceiver part for WCC circuit is designed using the conventional cross-coupled oscillator structure. To reduce the distortion of the signal, we input the data using the cascade structure. The receiver part for WCC circuit consists of coil. To confirm the characteristic of the proposed transceiver and receiver coil structures, we performed electromagnetic simulation. From the simulation results, the possibility of proposed wireless data transfer system was verified. The proposed wireless data transfer system has been designed using CMOS process. In simulation, the frequency of input data is 100 MHz and the peak-to-peak voltage of the input signal is 2 V. The peak-to-peak voltage of output signal is approximately 1.2 V and oscillation frequency is 1.75 GHz. The simulation result is shown that the transmitter part is transmitting signal which has only difference of 0.08 ns. Also it was found that wireless transceiver system has power consumption about 40%. In measurement result, data input setup 1MHz, and other setup is equal to that of the simulation. From the measured results, we successfully verify the feasibility of the proposed structure.
Abstract
In this study, a wireless type of chip-to-chip communication(WCC) technology is proposed as the next generation of three-dimensional(3D) semiconductor technology. To demonstrate the feasibility of the technology, we design a transceiver and receiver for wireless chip-to-chip communication method. The transceiver part for WCC circuit is designed using the conventional cross-coupled oscillator structure. To reduce the distortion of the signal, we input the data using the cascade structure. The receiver part for WCC circuit consists of coil. To confirm the characteristic of the proposed transceiver and receiver coil structures, we performed electromagnetic simulation. From the simulation results, the possibility of proposed wireless data transfer system was verified. The proposed wireless data transfer system has been designed using CMOS process. In simulation, the frequency of input data is 100 MHz and the peak-to-peak voltage of the input signal is 2 V. The peak-to-peak voltage of output signal is approximately 1.2 V and oscillation frequency is 1.75 GHz. The simulation result is shown that the transmitter part is transmitting signal which has only difference of 0.08 ns. Also it was found that wireless transceiver system has power consumption about 40%. In measurement result, data input setup 1MHz, and other setup is equal to that of the simulation. From the measured results, we successfully verify the feasibility of the proposed structure.
참고문헌 (21)
- Y. C. Lee, "Internal thermal resistance of a multi-chip packaging design for VLSI based systems", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 12(2), pp.163~169 (1989)
- J. -Q. Lu, "3-D hyperintegration and packaging technologies for micro-nano systems", Proceedings of the IEEE, 97(1), pp.18~30 (2009)
- Z. Xu, "Three-dimensional coaxial through-silicon-via (TSV) design", IEEE Electron Device Letters, 33(10), pp.1441~1443 (2012)
- C. Lee, "Study of the coil structure for wireless chip-to-chip communication applications", Progress In Electromagnetics Research Letters, 38, pp.127~136 (2013)
- C. Lee, "Zigzag-Shaped Coil Array Structure for Wireless Chip-to-Chip Communication Applications", IEEE Transactions on Electron Devices, 61(9), pp.3245~3251 (2014)
- C. Lee, "Transceiver with inductive coupling for wireless chip-to-chip communication using a 50-nm digital CMOS process", Microelectronics Journal, 44(9), pp.852~859 (2013)
- M. Abouelatta-Ebrahim, "Modelling of through silicon via and devices electromagnetic coupling", Microelectronics Journal, 42(2), pp.316~324 (2011)
- H. Oprins, "Fine grain thermal modeling and experimental validation of 3D-ICs", Microelectronics Journal, 42(4), pp.572~578 (2011)
- A. Zia, "3D NOC for many-core processors", Microelectronics Journal, 42(12), pp.1380~1390 (2011)
- V. Del, "Emulation-based transient thermal modeling of 2D", 3D systems-on-chip with active cooling, 2011, pp.42(4), 564~571
- K.-J. Gan, "Logic circuit design using monostable–bistable transition logic element based on standard BiCMOS process", Microelectronics Journal, 42(2), pp.477~482 (2011)
- M.A. Dehkordi, "Novel RAM cell designs based on inherent capabilities of quantum-dot cellular automata", Microelectronics Journal, 42(5), pp.701~708 (2011)
- K.-C. Tsai, "A 1.9-GHz, 1-W CMOS class-E power amplifier for wireless communications", IEEE Journal of Solid-State Circuits, 34(7), pp.962~970 (1999)
- C. Lee, "X-band CMOS power amplifier using mode-locking method for sensor applications", Journal of Electromagnetic Waves and Applications, 26(5-6), pp.633~640 (2012)
- J. Choi, "High-efficiency wireless energy transmission using magnetic resonance based on negative refractive index metamaterial", Progress In Electromagnetics Research, 106, pp.33~47 (2010)
- B.-J. Jang, "HF-band wireless power transfer system: Concept, issues, and design", Progress in electromagnetics research, 124, pp.211~231 (2012)
- X.C. Wei, "Simulation and experimental comparison of different coupling mechanisms for the wireless electricity transfer", Journal of Electromagnetic Waves and Applications, 23(7), pp.925~934 (2009)
- L. Peng, "Wireless energy transfer through non-resonant magnetic coupling", Journal of Electromagnetic Waves and Applications, 24(11-12), pp.1587~1598 (2010)
- L. Peng, "Performance analysis and experimental verification of mid-range wireless energy transfer through non-resonant magnetic coupling", Journal of Electromagnetic Waves and Applications, 25(5-6), pp.845~855 (2011)
- Y. Yuxiang, "Non-contact 10%efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS", Solid-State Circuits Conference, 2007. ASSCC'07. IEEE Asian. IEEE, pp.115~118 (2007)
- V. V. Kulkarni, "A 750 Mb", s, 12 pJ, IEEE Journal of Solid-State Circuits, pp.2009, 44(2)[DOI]