A Fully Integrated Circuit for High Current Multiple-Output
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초록
This paper presents a fully integrated circuit for high current multiple-output that can independently control supply voltage of several circuit building blocks. This work combines digital-to-analog converters (DACs) and low dropout regulators (LDOs) to offer a high output voltage resolution and a high output current capability. A resistor-floating-resistor-string DACs achieves a 10-bit resolution with a small silicon area. A multi-stage LDO removes voltage offsets with high loop gain and improves transient responses with high gain-bandwidth product. A test chip fabricated in a 0.18μm CMOS process achieves an output voltage range of 0.6 V to 1.3 V, maximum output current of 5 mA, voltage regulation accuracy of 0.7 mV with 1.8V VDD.
Abstract
This paper presents a fully integrated circuit for high current multiple-output that can independently control supply voltage of several circuit building blocks. This work combines digital-to-analog converters (DACs) and low dropout regulators (LDOs) to offer a high output voltage resolution and a high output current capability. A resistor-floating-resistor-string DACs achieves a 10-bit resolution with a small silicon area. A multi-stage LDO removes voltage offsets with high loop gain and improves transient responses with high gain-bandwidth product. A test chip fabricated in a 0.18μm CMOS process achieves an output voltage range of 0.6 V to 1.3 V, maximum output current of 5 mA, voltage regulation accuracy of 0.7 mV with 1.8V VDD.
참고문헌 (4)
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- C. -W. Lu, "A 10-bit Resistor-Floating-Resistor-String DAC(RFR-DAC)for High Color-Depth LCD Driver ICs", IEEE Journal of Solid-State Circuits, 47(10), pp.2454~2466 (2012)
- R. G. H. Eschauzier, "A 100-MHz 100-dB operational amplifier with multi-path nested Miller compensation structure", IEEE Journal of Solid-State Circuits, 27(12), pp.1709~1717 (1992)
- W. Qu, "Design-Oriented Analysis for Miller Compensation and Its Ap-plication to Multistage Amplifier Design", IEEE Jour-nal of Solid-State Circuits, 52(2), pp.517~527 (2017)
