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255-GHz InP HBT Power Amplifiers Using Custom-designed Two-finger Devices

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초록

This paper investigates the possible advantages in using two-finger InP heterojunction bipolar transistors (HBT) for WR-3.4 (220 GHz – 320 GHz) power amplifiers (PA). The two-finger HBT is designed by combining two 6-m emitter length single-finger HBTs provided by Teledyne. Expected performances of two versions of two-finger device are simulated. One is designed with two separate isolation layers and the other one with single joined isolation layer. Both two-finger devices have better power performance but shows poor fmax and MAG compared to a single-finger device. Two PA designs in common-base differential configuration utilizing two types of custom two-finger devices are fabricated. The joined-isolation-device PA shows better performance with the peak gain of 10.5 dB at 255 GHz and P1dB and Psat of -1.7 dBm and 5.2 dBm while the separated-isolation-device PA shows peak gain of 4.6 dB at 255 GHz and P1dB and Psat of -8.5 dBm and 4.4 dBm.

Abstract

This paper investigates the possible advantages in using two-finger InP heterojunction bipolar transistors (HBT) for WR-3.4 (220 GHz – 320 GHz) power amplifiers (PA). The two-finger HBT is designed by combining two 6-m emitter length single-finger HBTs provided by Teledyne. Expected performances of two versions of two-finger device are simulated. One is designed with two separate isolation layers and the other one with single joined isolation layer. Both two-finger devices have better power performance but shows poor fmax and MAG compared to a single-finger device. Two PA designs in common-base differential configuration utilizing two types of custom two-finger devices are fabricated. The joined-isolation-device PA shows better performance with the peak gain of 10.5 dB at 255 GHz and P1dB and Psat of -1.7 dBm and 5.2 dBm while the separated-isolation-device PA shows peak gain of 4.6 dB at 255 GHz and P1dB and Psat of -8.5 dBm and 4.4 dBm.

참고문헌 (7)

  1. Schoch, B, "300 GHz broadband power amplifier with 508 GHz gain-bandwidth product and 8dBm output power", 2019 IEEE MTT-S International Microwave Symposium (IMS), pp.1249~1252 (2019), IEEE
  2. Reed, T. B, "A 180mW InP HBT power amplifier MMIC at 214 GHz", 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), pp.1~4 (2013), IEEE
  3. Griffith, "180–265 GHz, 17–24 dBm output power broadband, highgain power amplifiers in InP HBT", 2017 IEEE MTT-S International Microwave Symposium (IMS) (2017), IEEE
  4. Kim, Jungsik, "H-band power amplifier integrated circuits using 250-nm InP HBT technology", IEEE Transactions on Terahertz Science and Technology, 5(2), pp.215~222 (2015)
  5. Griffith Z, "Multi-finger 250-nm InP HBTs for 220-GHz mm-wave power", Proc. Int. Conf. Indium Phosphide and Related Materials, pp.204~207 (2012)
  6. Ahmed AS, "A compact H-band Power Amplifier with High Output Power", IEEE Radio-Frequency IC Symp, pp.123~126 (2021)
  7. Mei, X, "First demonstration of amplification at 1 THz using 25-nm InP high electron mobility transistor process", IEEE Electron Device Letters, 36(4), pp.327~329 (2015)

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