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반도체 AMC 모니터링용 샘플링 테스트 모듈에 관한 연구

A Study on Sampling Test Module for Semiconductor AMC Monitoring

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참고문헌

키워드

주제분류기계공학

초록

The sampling test module of the existing AMC Monitoring System is constructed using tubes and fittings, so there has been a problem with molecular contaminants remaining in the system. This study demonstrated how a new manifold-type sampling test module without connecting tubes and fittings, and with super-hydrophobic coating improves residual molecular contaminants in the AMC Monitoring System through CDA purge when molecular contamination occurs in a clean room with a Semiconductor Fabrication.

Abstract

The sampling test module of the existing AMC Monitoring System is constructed using tubes and fittings, so there has been a problem with molecular contaminants remaining in the system. This study demonstrated how a new manifold-type sampling test module without connecting tubes and fittings, and with super-hydrophobic coating improves residual molecular contaminants in the AMC Monitoring System through CDA purge when molecular contamination occurs in a clean room with a Semiconductor Fabrication.

참고문헌 (6)

  1. Choi, J. H, "AMC(Airborne Molecular Contamination) Contamination Source and Control System in the Outside Air that Affects Semiconductor Processes", Air Cleaning Technology, 14(2), pp.66~78 (2001)
  2. Sung, W. D., "The Effects of Molecular Chemical Contamination on the Photolithography Process in Semiconductor Production", Doctor, pp.2004
  3. Kim, K. Y, "Information of Contamination in Semiconductor Cleanroom", Journal of the Korean Society of Precision Engineering, 19(8), pp.7~15 (2002)
  4. The development of ultra low concentration monitoring technologies for the airborne molecular contamination and total monitoring control system, "Kim, K. Y", Ministry of Science and Technology, ~ (2003)
  5. Jo, H. N, "An Intelligent Monitoring Framework to Recognize Airborne Molecular Contamination in Semiconductor Manufacturing Cleanroom", The Korean Society of Analytical Sciences, 2022(11), pp.36~ (2022)

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