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반도체 AMC 모니터링 시스템용 솔레노이드 밸브 신뢰성 테스트에 관한 연구

A Study on Reliability Test of Solenoid Valve for Semiconductor AMC Monitoring System

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키워드

주제분류기계공학

초록

In the semiconductor manufacturing clean room, contamination that directly affects process yield is managed through the operation of a monitoring system that measures molecular contamination in the air. In this study, I presented the component inspection method, test conditions, and judgment criteria through the life test of the solenoid valve that will be applied to the sampling module of the AMC Monitoring System.

Abstract

In the semiconductor manufacturing clean room, contamination that directly affects process yield is managed through the operation of a monitoring system that measures molecular contamination in the air. In this study, I presented the component inspection method, test conditions, and judgment criteria through the life test of the solenoid valve that will be applied to the sampling module of the AMC Monitoring System.

참고문헌 (6)

  1. Choi, J. H, "AMC(Airborne Molecular Contamination) Contamination Source and Control System in the Outside Air that Affects Semiconductor Processes", Air Cleaning Technology, 14(2), pp.66~78 (2001)
  2. Sung, W. D., "The Effects of Molecular Chemical Contamination on the Photolithography Process in Semiconductor Production", Doctor, pp.2004
  3. Jo, H. N, "An Intelligent Monitoring Framework to Recognize Airborne Molecular Contamination in Semiconductor Manufacturing Cleanroom", The Korean Society of Analytical Sciences, 2022(11), pp.36~ (2022)
  4. The development of ultra low concentration monitoring technologies for the airborne molecular contamination and total monitoring control system, "Kim, K. Y", Ministry of Science and Technology, ~ (2003)
  5. Jeong, S. H, "Study on Design Method of Solenoid Valve", The Korean Society of Propulsion Engineers, 2019(5), pp.674~678 (2019)
  6. Lee, J. Y, "Life Cycling Test for Pilot Valve using Controller of Solenoid Valve", The Korean Society for Aeronautical and Space Sciences, 2017(11), pp.1060~1062 (2017)

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