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Ti3C2TX MXene 기반 유연 전극 기술 개발 동향

Technical Trends of Ti3C2TX MXene-based Flexible Electrodes

김종웅|최수빈|미나자간싱
한국마이크로전자및패키징학회 (The Microelectronics And Packaging Society)|2022.03|마이크로전자 및 패키징학회지 (Jornal of the Microelectronics and Packaging Society)|제29권 제1호|pp. 17-33|DOI https://dx.doi.org/10.6117/kmeps.2022.29.1.017

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FlexiblesensorbatteryTi3C2TX MXeneelectrode
주제분류재료공학

초록

2011년 Naguib 그룹에서 처음 보고한 Ti3C2TX MXene은 우수한 친수성, 전기 전도성 및 기계적/화학적 안정성으로 인해 큰 주목을 받고 있다. 특히, MXene은 수 나노미터 두께를 지닌 2차원 물질이므로 유연성을 확보하기에 용이하기 때문에 스마트 센서, 에너지 하베스팅/저장 시스템, 수퍼커패시터 및 전자기 차폐 시스템 등 여러 분야에 적용하고자 한 연구 결과가 많이 보고되었다. 본 논문에서는 Ti3C2TX MXene의 다양한 합성 공정 및 특성에 대해 간략히 소개한 후, Ti3C2TX MXene을 유연 전극 물질로 이용한 최근 연구 결과를 알아보고자 한다.

Abstract

Ti3C2TX MXene, first reported by Naguib et al. in 2011, has attracted tremendous attention due to its excellent hydrophilicity, electrical conductivity, and mechanical/chemical stability. Since MXene is a two-dimensional material with a thickness of few nanometers, which ensure its flexibility. In last few years, due to these properties many researchers used Ti3C2TX MXene into various fields such as flexible smart sensors, energy harvesting/storage devices, supercapacitors and electromagnetic interference shielding systems. In this review article, we have briefly discussed the various synthesis processes and characteristics of Ti3C2TX MXene. Moreover, we reviewed the latest development of Ti3C2TX MXene as flexible electrode material to be used into different applications.

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관련 논문AI추천

Ti3C2Tx MXene 기반 전극 소재의 자가 치유 적용 기술 개발 동향김종웅, 정승부, 최준상한국마이크로전자및패키징학회 · 마이크로전자 및 패키징학회지2023 · 제30권 제3호차세대 2차원 소재, MXenes의 연구 동향변종민, 윤예준, 이호준, 장진광한국분말재료학회 · 한국분말재료학회지2021 · 제28권 제2호전자 소자 응용을 위한 MXene의 산화 공정 및 물성 분석 연구박준홍, 박지혜, Somnath S. Kundale, Windy Ayu Lestar한국결정성장학회 · 한국결정성장학회지2024 · 제34권 제6호카본우븐패브릭 기반 2D 구조의 Ti3C2Tx 배터리음극소재남상희, 오세웅, 오일권, Sima Umrao한국복합재료학회 · Composites Research2019 · 제32권 제5호열처리에 의한 Ti 기반 MXene 소재의 구조 변화와 전자파 간섭 차폐 특성에 관한 연구경지수, 슈에한, 우윤성한국마이크로전자및패키징학회 · 마이크로전자 및 패키징학회지2023 · 제30권 제3호신축성 전극 기술 개발 동향김종웅, 이철로, 정승부, 최수빈한국마이크로전자및패키징학회 · 마이크로전자 및 패키징학회지2019 · 제26권 제3호

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