폴리이미드 종류에 따른 연성 동박 적층판의 부착력 연구
Research on the Adhesion of Flexible Copper Clad Laminates According to Species of Polymide
0
조회
0
다운로드
1
인용
0
참고문헌
초록
Abstract
Flexible copper clad laminates(FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializing it. Chromium(Cr) which strongly reacts with O moiety was used as tie-coating layer in order to improve low adhesion between copper(Cu) and polyimide(PI). Sputtering raw polyimide(SRPI) and casting raw polyimide(CRPI) were used as substrates at this research. PI was pretreated by plasma before sputtering, and each sample was varied with RF power and Cr thickness on sputtering. Peel strength of the FCCL on SRPI was higher than that on CRPI. Adhesion had maximum value when 10nm of Cr was deposited on SRPI by RF power of 50W. It seems to be by the formation of Cu- Cr-O solid solution at the metal-PI interface.
참고문헌 (7)
- "Weekly electronics information", 7(4), pp.1~22 (2004)
- "Low cost flex substrates for miniaturized electronic assemblies", 42, pp.1091~1099 (2002)
- "TEM analysis of interfaces between Cr film sputtered with RF bias and photosensitive polyimide", 10(2), pp.39~47 (2003)
- "Material characterization of Cu(Ti)-polyimide thin film stacks", 359, pp.255~260 (2000)
- "The surface effect of polyimide thin film by vapor deposition polymerization method with plasma treatment", 5, pp.340~346 (1998)
- "Surface and adhesion characteristics of polyimide film treated by corona discharge", 40(5), pp.613~617 (2002)
- "Effect of an international layer on adhesion strength deterioration between a copper thin film and polyimide substrates", 51(4), pp.615~618 (1998)