모아레 간섭계와 모델교정법을 이용한솔더 합금의 점소성 물성치 역추정
Inverse Estimation of Viscoplastic Properties of Solder Alloy Using Moiré Interferometry and Computer Model Calibration
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초록
본 연구에서는 전자패키지에 사용되는 솔더 재료의 점소성 물성치를 규명하였다. 이를 위해 전자패키지와 비슷한 변형을 보이는 시편을 제작하였고 모아레 간섭계를 이용하여 열사이클 하에서의 변형을 측정한 뒤 시편의 굽힘 변위와 솔더의 전단 변형률을 구하였다. 시편에 대해 점소성 유한요소해석을 실시하였고 해석 결과가 실험 결과에 일치하도록 물성치를 역으로 추정하였다. 실험에서 발생한 측정오차와 실험횟수 부족 등의 불확실성을 고려하기 위해 컴퓨터 모델 교정법을 이용하였고, 그 결과 추정된 물성치는 평균 및 신뢰구간으로 표현되었으며, 이로 인한 유한요소해석 결과도 마찬가지로 평균 및 신뢰구간으로 표현되었다.
Abstract
In this study, viscoplastic material properties of solder alloy which is used in the electronics packages are inversely estimated. A specimen is fabricated to this end, and an experiment is conducted to examine deformation by Moiré interferometry. As a result of the experiment, bending displacement of the specimen and shear strain of the solder are obtained. A viscoplastic finite element analysis procedure is established, and the material parameters are determined to match closely with the experiments. The uncertainties which include inherent experimental error and insufficient data of experiments are addressed by using the method of computer model calibration. As a result, material parameters are identified in the form of confidence interval, and the displacements and strains using these parameters are predicted in the form the prediction interval.
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