유연 솔더와 무연 솔더의 점소성 변형거동 평가
Assessment of Viscoplastic Deformation Behavior of Eutectic Solder and Lead-free Solder
1
조회
0
다운로드
4
인용
0
참고문헌
키워드
초록
본 논문에서는 솔더의 온도 변화에 따른 변형 거동을 평가하기 위하여 솔더 재료의 열변형 거동을 파악할 수있는 전단시편을 고안하여 온도변화에 따르는 열변형 실험과 유한요소해석을 수행하였다. 전단시편은 열팽창계수가 다른 두 금속 막대와 그 사이 공간에 접합된 솔더로 구성되어 있으며, 솔더는 유연 솔더 (Sn/36Pb/2Ag)와 무연 솔더 (Sn/3.0Ag/0.5Cu) 두가지를 대상으로 하였다. 실시간 무아레 간섭계를 이용하여 세 온도 사이클 동안의 각 온도단계에서 변위 분포를 나타내는 간섭무늬를 얻고 그로부터 온도에 따른 유연 솔더와 무연 솔더의 열변형 특성을 비교하였다. 유한요소해석을 통하여 여러 연구자가 제시한 솔더의 점소성 물성치를 평가하였으며 유연 솔더의 경우에는 Darveaux가 제안한Anand 모델, 무연 솔더의 경우 Chang이 제안한 Anand 모델을 사용한 해석 결과가 실험 결과와 가장 일치한다는 것을 밝혔다. 평가된 재료 모델을 사용하여 무연 솔더와 유연 솔더가 포함된 전단시편을 유한요소 해석하고 솔더의 점소성 거동을 자세하게 분석하였다.
Abstract
This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moiré setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.
참고문헌 (25)
- J. S. Corbin, "Finite Element Analysis for Solder Ball Connect (SBC) Structural design Optimization", IBM J. Research Development, 통권 : 37, pp.585~ (1993)
- T. Lee, "Finite Element Analysis for Solder Ball Failures in Chip Scale Packages", Microelectronics and Reliability, 38(2), pp.1941~ (1998)
- S. C. Chen, "The Numerical Analysis of Strain Behavior at the Solder Joint and Interface in a Flip Chip Package", J. Materials Processing Technology, 통권 : 171, pp.125~ (2006)
- 장임남, "패드 구조에 따른 Sn-Ag-Cu계 무연 솔더볼 접합부의 기계적 특성평가", 마이크로전자 및 패키징학회지, 17(2), pp.41~47 (2010), 한국마이크로전자및패키징학회
- 이순복, "무연솔더(SnAgCu)와 유연솔더(SnPb)의 피로 수명 비교 연구", 대한기계학회논문집 A, 28(12), pp.1856~1863 (2004), 대한기계학회
- M. Gonzalez, "Thermo- Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications", Proc. EMPC2005 (2005)
- Q. Wang, "Anand Parameter Test for Pb-Free Material SnAgCu and Life Prediction for a CSP", Proc. ICEPT 2007 (2007)
- X. Chen, "Modified Anand constitutive model for lead-free solder Sn-3.5Ag", Proc. ITHERM '04, pp.446~ (2004)
- John H. Lau, "Creep Behaviors of Flip Chip on Board With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints", Intern'l J. of Microcircuits and Electronic Packaging, 24(1), pp.11~ (2001)
- B. Han, "Recent Advancements of Moire and Microscopic MoiréInterferometry for Thermal Deformation Analysis of Microelectronics Devices", Experimental Mechanics, 38(4), pp.278~ (1998)
- 이순복, "Measurement of creep and relaxation behaviors of wafer-level CSP assembly using Moire interferometry", JOURNAL OF ELECTRONIC PACKAGING, 125통권 : 125, pp.282~, Trans. of the ASME
- "Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moire interferometry", MICROELECTRONICS RELIABILITY, 45(4), pp.637~
- D. Pollack, "Experimental Validation of Unified Constitutive Model of Eutectic Solder", Proc. of Society for Experimental Mechanics (2003)
- 주진원, "Flip Chip PBGA 패키지의 온도변화에 대한 변형거동 해석", 마이크로전자 및 패키징학회지, 13(4), pp.17~26 (2006), 한국마이크로전자및패키징학회
- 최남진, "플립 칩 패키지 솔더의 탄소성 거동과 크립 해석", 마이크로전자 및 패키징학회지, 17(2), pp.21~28 (2010), 한국마이크로전자및패키징학회
- 이봉희, "무아레 간섭계를 이용한 유연 솔더와 무연 솔더 실장 WB-PBGA 패키지의 열-기계적 변형 거동", 마이크로전자 및 패키징학회지, 17(3), pp.17~26 (2010), 한국마이크로전자및패키징학회
- F. Garofalo, "Fundamentals of Creep and Creep-Rupture in Metal" (1965), The Macmillian Company
- L. Anand, "Constitutive Equations for Hot-Working of Metal", Inter. J. of Plasticity, 통권 : 1, pp.213~ (1985)
- S. Wiese, "Microstructural Dependence of Constitutive Properties of Eutectic SnAg and SnAgCu Solder", Proc. of 53th Electronic Components and Technology Conference, pp.197~ (2003)
- F. Feustel, "Time-Dependent Material Modeling for Finite Element Analyses of Flip Chips", Proceedings of 50th Electronic Components and Technology Conference, pp.1548~ (2000)
- R. Darveaux, "Solder Joint Fatigue Life Model", Proceedings of 1997 TMS Annual Meeting, pp.213~ (1997)
- G. Z. Wang, "Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys", Journal of Electronic Packaging, 123(3), pp.247~ (2001)
- A. Yeo, "Flip Chip Solder Reliability Analysis Using ViscoPlastic and Elastic-Plastic-Creep Constitutive Models", IEEE Transactions on Compo nents and Packaging Technologies, 29(2), pp.355~ (2006)
- J. Chang, "Finite Element Modeling Predicts the Effects of Voids on Thermal Shock Reliability and Thermal Resistance of Power Device", Welding Journal, (85), pp.63~ (2006)
- K. Mysore, "Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy", IEEE Transactions on Electronics Packaging Manufacturing, 32(4), pp.221~ (2009)