電解生成된 鹽素에 의한 廢印刷回路基板으로부터 銅의 浸出
Leaching of Copper from Waste Printed Circuit Boards Using Electro-generated Chlorine in Hydrochloric Acid
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초록
염산용액에서 전해생성 된 염소를 이용하여 폐프린터의 인쇄회로기판으로부터 동을 침출하는 연구를 수행하였다. 폐인쇄회로기판을 분쇄한 다음 입자크기가 0.6~1.2mm인 비자성 성분을 선별하여 침출실험을 행하였다. 비자성 분쇄물 중 금속성분의 평균함량은 45wt%이었으며, 동이 금속성분의 83.6wt% 이었다. 1M 염산용액에서 전해생성 된 염소에 의한 동의 침출반응은 전류밀도와 교반속도에 크게 영향을 받았다. 염산농도; 1M, 전류밀도; 20mA/cm2, 침출온도; 50oC, 침출시간; 180분, 교반속도; 600rpm의 침출조건에서 동의 침출율은 98%로서 침출액에서 농도는 3.69g/l에 해당하였다. 동의 침출반응에 대한 전해생성 된 염소의 이용율은 교반속도가 높고 인가전류밀도가 낮을수록 높았다. 또한 침출반응 초기에는 알루미늄, 납, 주석 등의 기타금속 성분의 침출이 활발하고 동의 침출반응은 억제되었다.
Abstract
Electro-generated chlorine leaching of waste printed circuit boards was investigated in hydrochloric acid solutions. Non-magnetic component of 0.6~1.2 mm was prepared by grinding, magnetic separation, and sieving. The non-magnetic component of pulverized printed circuit board contained about 45% of metal component, in which copper was about 83.6%. The leaching rate of copper was greatly affected by current density and agitation speed. The leaching of copper up to 98% was achieved at 20 mA/cm2, 50oC, 180 minutes, and 600 rpm in 1 M HCl solutions. Increasing agitation and lowering current density enhanced utilization efficiency of electro-generated chlorine. Leaching of copper was suppressed at the initial stage, while the minor metal elements, such as aluminum, lead, and tin, were dominantly leached out.
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