폐인쇄회로기판으로부터 구리 산침출 거동의 비교연구
A Comparative Study of Acid Leaching Behavior of Copper from Waste
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초록
질산과 황산을 침출제로 사용하여 분쇄된 폐인쇄회로기판으로부터 구리의 침출거동에 대한 연구를 수행하였다. 황산 침출에서는 과산화수소를 산화제로 첨가하였다. 침출제의 농도, 침출시간과 온도, 과산화수소의 농도, 광액농도 등이 구리의 침출에 미치는 영향을 조사하였다. 질산용액에 의한 구리 침출의 최적조건은 질산농도 4.0 M, 광액농도 100 g/L, 침출온도 90℃, 침출시간 120분이며, 이 때 구리의 침출율은 96% 이었다. 황산농도 2.0 M, 과산화수소 농도 10 vol.%, 광액농도 50 g/L, 침출온도 50℃, 침출시간 120분의 침출조건에서 87%의 구리가 침출되었으며, 광액농도가 50 g/L 이상으로 증가함에 따라 구리 침출율은 급격히 감소하였다. 솔더의 합금원소인 주석과 납은 각각 질산침출에서 주석산, 황산침출에서 황산납으로 석출되어 매우 낮은 침출율을 나타내었다.
Abstract
Leaching of copper from the shredded waste printed circuit boards has been studied in nitric and sulfuric acid solutions. Hydrogen peroxide was added as oxidant in the case of sulfuric acid leaching. Effects of parameters such as acid and hydrogen peroxide concentrations, solution temperature, pulp density, and leaching time were investigated. In the nitric acid solution, an optimum copper dissolution of 96% was obtained in 120 min at 90℃ temperature, 100 g/L pulp density and 4.0 M HNO3 concentration. In the 2.0 M sulfuric acid solution with 10 vol.% hydrogen peroxide, 87% of copper was leached out in 120 min at 50℃ temperature and 50 g/L pulp density; the leaching of copper decreased remarkably by increasing the pulp density beyond 50 g/L. Tin and lead, the alloy components of solder, were leached into solution to less than 5% because of precipitation of tin as stannic acid in nitric acid and lead as sulfate in sulfuric acid solutions, respectively.
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