염화주석용액을 이용한 폐인쇄회로기판으로부터 부품의 분리
Dismantling of Components from Waste Printed Circuit Boards Using Stannic Chloride Solution
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초록
폐인쇄회로기판으로부터 부품을 분리하기 위하여 4가 주석이온 (Sn4+)을 포함한 염산용액을 이용하여 탈착실험을 진행하고, 부품탈착에 대한 교반속도, 반응온도, 4가 주석이온농도, 염산용액농도의 영향을 조사하였다. 100 rpm~300 rpm의 교반속도에서 PCB로부터부품의 탈착속도는 큰 차이가 없었으며, 반응온도, 4가 주석이온농도, 그리고 염산용액농도를 증가시킴에 따라 탈착속도도 증가하였다. 모든 부품 탈착실험에서 탈착율이 100%에 도달하였을 때 기판에서 솔더는 관찰되지 않았으며 주석농도는 약 1,500 mg/L였다. 10,000 mg/L 의 4가 주석이온을 포함한 1 mol/L의 염산용액에 폐하드디스크 PCB 1개를 투입하고, 교반속도와 반응온도를 각각 200 rpm과 90 °C로조정한 탈착실험에서 PCB로부터 부품의 탈착은 2시간만에 100% 완료되었다.
Abstract
Dismantling tests were performed to separate components from waste printed circuit boards (PCBs) using HCl solution with Sn4+ . Then, the effects of agitation speed, reaction temperature, initial Sn4+ concentration, and HCl concentration on the dismantling of components were investigated. No significant effect on the dismantling speed was observed upon changing the agitation speed from 100 to 300 rpm. However, the dismantling rate increased with increasing reaction temperature, Sn4+ concentration, and HCl concentration. In the all-component dismantling tests, when the dismantling ratio increased to 100%, no solder was observed on the boards, and the Sn4+ concentration was ~1,500 mg/L. The dismantling ratio of the components from the PCB increased to 100% within 2 h when 1 mol/L HCl solution with 10,000 mg/L Sn4+ was used at an agitation speed and temperature of 200 rpm and 90 ℃, respectively.
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