Sensitivity Analysis of the 217Plus™ Component Models for Reliability Prediction of Electronic Systems
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초록
MIL-HDBK-217 has played a pivotal role in reliability prediction of electronic equipments for more than 30 years. Recently, RIAC developed a new methodology 217Plus™, which officially replaces MIL-HDBK-217. Sensitivity analysis of the 217Plus component models to various parameters has been performed and meaningful observations have been drawn in this study. We first briefly reviewed the 217Plus™ methodolog and compared it with the conventional model, MIL-HDBK-217. We then performed sensitivity analysis 217Plus™ component models to various parameters. Based on the six parameters and an orthogonal array selected, we have performed indepth analyses concerning parameter effects on the model. Our result indicates that, among various parameters,operating temperature and temperature rise during operation have the most significant impacts on the life of a component, and thus a design robust to high temperature is the most importantly required. Next, year of manufacture, duty cycle, and voltage stress are weaker but may be significant when they are in heavy load conditions. Although our study is restricted to a specific type of diodes, the results are still valid to other cases. The results in this study not only figure out the behavior of the predicted failure rate as a function of parameters but provide meaningful guidelines for practical applications.
Abstract
MIL-HDBK-217 has played a pivotal role in reliability prediction of electronic equipments for more than 30 years. Recently, RIAC developed a new methodology 217Plus™, which officially replaces MIL-HDBK-217. Sensitivity analysis of the 217Plus component models to various parameters has been performed and meaningful observations have been drawn in this study. We first briefly reviewed the 217Plus™ methodolog and compared it with the conventional model, MIL-HDBK-217. We then performed sensitivity analysis 217Plus™ component models to various parameters. Based on the six parameters and an orthogonal array selected, we have performed indepth analyses concerning parameter effects on the model. Our result indicates that, among various parameters,operating temperature and temperature rise during operation have the most significant impacts on the life of a component, and thus a design robust to high temperature is the most importantly required. Next, year of manufacture, duty cycle, and voltage stress are weaker but may be significant when they are in heavy load conditions. Although our study is restricted to a specific type of diodes, the results are still valid to other cases. The results in this study not only figure out the behavior of the predicted failure rate as a function of parameters but provide meaningful guidelines for practical applications.
참고문헌 (13)
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- Smith, C., "Raytheon Assessment of PRISM as a field failure prediction", IEEE Annual Reliability and maintainability Symposium Proceedings (2004)
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- Taguchi, G., "Taguchi’s Quality Engineering Handbook" (2005), John Wiley & Sons Inc
- Jeon, T. B., "Reliability Predictions of Electrical and Electronic System" (2010), Kyowoosa
- Nicholls, D., "An Introduction to the RIAC 217PlusTM Component Failure Rate Models", RIAC Journal, (1), pp.16~21 (2007)
- Nicholls, D., "The RIAC 217PlusTM Capacity and Diode Failure Rate Models", RIAC Journal, (2), pp.16~21 (2007)