열전 냉각기를 포함하는 볼로미터 패키지의 SPICE 등가 모델링
SPICE-Compatible Modeling of a Microbolometer Package Including Thermoelectric Cooler
1
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.
Abstract
For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.
참고문헌 (11)
- 김진수, "볼로미터형 적외선 센서의 신호처리회로 설계 및 특성", 센서학회지, 16(6), pp.475~483 (2007), 한국센서학회
- 김경민, "비정질 실리콘을 이용한 미세 피치 적외선 이미지 센서 제조 및 특성", 센서학회지, 19(2), pp.130~136 (2010), 한국센서학회
- J. Choi, "Design and control of a thermal stabilizing system for a MEMS optomechanical uncooled infrared imaging camera", Sens. Actuators, 104, pp.132~142 (2003)
- N. Wang, "Numerical study on thermal management of LED packaging by using thermoelectric cooling", Proc. of ICEPT-HDP, pp.433~437 (2009)
- G. Baldazzi, "Thermoregulation of silicon photomultipliers for space", Nucl. Instr. Meth. Phys. Res, 610, pp.384~386 (2009)
- C. S. Premachandran, "Design & development of a new thermally stable high vacuum IR bolometer package", Proc. of IEEE ECTC, pp.392~396 (2003)
- S. Lineykin, "Modeling and analysis of thermoelectric modules", IEEE Trans. Ind. App, 43(2), pp.505~512 (2007)
- J. A. Chávez, "SPICE model of thermoelectric elements including thermal effects", Proc. of IEEE IMTC, pp.1019~1013 (2000)
- E. E. Antonova, "Finite elements for thermoelectric device analysis in ANSYS", Proc. of IEEE Conf. on Thermoelectrics, pp.200~203 (2005)
- M. Jaegle, "Multiphysics simulation of thermoelectric systems-modeling of Peltier-cooling and thermoelectric generation", Proc. COMSOL Conf (2008)
- 한승오, "Coupled Physics Analyses of VOx-Based, Three-Level Microbolometer", Electronic Materials Letters, 5(2), pp.63~65 (2009), 대한금속·재료학회