PDMS 몰드를 이용한 초고온 MEMS용 SiCN 미세구조물 제작과 그 특성
Fabrication of SiCN microstructures for super-high temperature MEMS using PDMS mold and its characteristics
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Abstract
This paper describes a novel processing technique for fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for super-temperature MEMS applications. PDMS (polydimethylsiloxane) mold is fabricated on SU-8 photoresist using standard UV photolithographic process. Liquid precursor is injected into the PDMS mold. Finally, solid polymer structure is cross-linked using HIP (hot isostatic pressure) at 400oC, 205bar. Optimum pyrolysis and annealing conditions are determined to form a ceramic microstructure capable of withstanding over 1400oC. The fabricated SiCN ceramic microstructure has excellent characteristics, such as shear strength (15.2N), insulation resistance (2.1631014 ) and BDV (min. 1.2kV) under optimum process condition. These fabricated SiCN ceramic microstructures have greater electric and physical characteristics than bulk Si wafer. The fabricated SiCN microstructures would be applied for super-temperature MEMS applications such as heat exchanger and combustion chamber.
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