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3차원 마이크로 구조를 위한 포토레지스트 스프레이 코팅

Photoresist spray coating for three-dimensional micro structure

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초록

Abstract

This paper presents the method for three-dimensional micro structure with photoresist spray coating system. The system consists of a high temperature rotational chuck, ultrasonic spray nozzle module, angle control module and nozzle moving module. Spray coating system is effected by several parameters such as the solid contents, the dispensed volume, the scanning speed of the spray nozzle and the wafer of dimension. The photoresist (AZ 1512) has been coated on the three-dimensional micro structure by spray coating system and the characteristics have been evaluated.

참고문헌 (8)

  1. N. P. Pham, "A model for film thickness using direct spray coating", pp.773~776 (2003)
  2. V. K. Singh, "Photolithography on three-dimensional structures using spray coated negative and positive photoresists", pp.1445~1448 (2005)
  3. V. K. Singh, "Spray coated photoresist over anisotropically etched deep Si cavities", pp.188~189 (2002)
  4. N. P. Pham, "Photoresist coating methods for the integration of novel 3-D RF microstructures", 13(3), pp.491~499 (2004)
  5. K. Fischer, "Spray coating - a solution for resist film deposition across severe topography" (2004)
  6. V. K. Singh, "Technique for preparing defect-free spray coated resist film", pp.817~820 (2003)
  7. M. Ichiki, "Spray coating fabrication", pp.825~828 (2003)
  8. G. Percin, "Photoresist deposition without spinning", 16(3), pp.452~459 (2003)

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