A Polymer-based Capacitive Air Flow Sensor with a Readout IC and a Temperature Sensor
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This paper presents an air flow sensor (AFS) based on a polymer thin film. This AFS primarily consists of a polymer membrane attached to a metal-patterned glass substrate and a temperature-sensing element composed of NiCr. These two components were inte-grated on a single glass substrate. The AFS measures changes in capacitance caused by deformation of the polymer membrane basedon the air flow and simultaneously detects the temperature of the surrounding environment. A readout integrated circuit (ROIC) was also fabricated for signal processing, and an ROIC chip, 1.8 mm by 1.9 mm in size, was packaged with an AFS in the form of a system-in-package module. The total size of the AFS is 1 by 1 cm, and the diameter and thickness of the circular-shaped polymer membraneare 4 mm and 15 µm, respectively. The rate of change of the capacitance is approximately 11.2% for air flows ranging between 0 and40 m/s
Abstract
This paper presents an air flow sensor (AFS) based on a polymer thin film. This AFS primarily consists of a polymer membrane attached to a metal-patterned glass substrate and a temperature-sensing element composed of NiCr. These two components were inte-grated on a single glass substrate. The AFS measures changes in capacitance caused by deformation of the polymer membrane basedon the air flow and simultaneously detects the temperature of the surrounding environment. A readout integrated circuit (ROIC) was also fabricated for signal processing, and an ROIC chip, 1.8 mm by 1.9 mm in size, was packaged with an AFS in the form of a system-in-package module. The total size of the AFS is 1 by 1 cm, and the diameter and thickness of the circular-shaped polymer membraneare 4 mm and 15 µm, respectively. The rate of change of the capacitance is approximately 11.2% for air flows ranging between 0 and40 m/s
참고문헌 (16)
- L. Gu, "A novel capacitve-type humidity sensor using CMOS fabrication technology", Sens. Actuators B, 99, pp.491~498 (2004)
- U. Kang, "A high-speed capacitive humidity sensor with on-chip thermal reset", IEEE Trans. Electron. Devices, 47, pp.702~710 (2000)
- J. Laconte, "Capacitive humidity sensor using a polyimide sensing film", DTIP MEMS MOEMS, pp.223~228 (2003)
- C. Dai, "A capacitive humidity sensor integrated with micro heater and ringoscillator circuit fabricated by CMOS–MEMS technique", Sens. Actuators B, 1(6) (2006)
- S. Park, "A flow direction sensor fabricated using MEMS technology and its simple interface circuit", Sens. Actuators B, 91, pp.347~352 (2003)
- J. E. Sundeen, "Thermal sensor properties of cermet resistor films on silicon substrates", Sens. Actuators B, 90(xx), pp.118~124 (2001)
- A. Talić, "Novel Thermal Flow Sensors Based on a Wheatstone Bridge Read-out", Procedia Chem, 1, pp.136~119 (2009)
- A. Helwig, "Temperature characterization of silicon substrates for gas sensors by Raman spectroscopy", Sens. Actuators B, 126, pp.240~244 (2007)
- P. Bruschi, "Design and analysis of integrated flow sensors by means of a two-dimensional finite element model", Sens. Actuators B, 142(xx), pp.153~159 (2008)
- M. Kimura, "Proposal of a new structural thermal vacuum sensor with diode-thermistors combined with a micro-air-bridge heater", Microelectronics J, 38, pp.171~176 (2007)
- N. T. Nguyen, "A novel thermal sensor concept for flow direction and flow velocity", IEEE Sens. J., 5, pp.1224~1234 (2005)
- Y. H. Wang, "A MEMS-based Air Flow Sensor with a Free-standing Microcantilever", Sensors, 7, pp.2389~2401 (2007)
- R. E. Oosterbroek, "A micromachined pressurerflow-sensor", Sens. Actuators B, 77, pp.167~177 (1999)
- Z. W. Wei, "A Novel 2-D Capacitive Silicon Flow Sensor", IEEE SENSORS Conference (2007)
- C. M. Bruinink, "Advancements in Technokogy and design of biometic flow sensor arrays", Micro Electro Mechanical Systems, IEEE 22nd International Conference (2009)
- S. Satyanarayana, "Parylene micro membrane capacitive sensor array for chemical and biological sensing", Sens. Actuators B, 115, pp.494~502 (2006)