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알루미늄 다공성소재를 이용한 RFID Tag용 열차폐부품 개발

Development of Heat Shielding Part for RFID Tag using Porous Aluminum Alloy

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키워드

주제분류금속공학

초록

The RFID (Radio-Frequency Identification) is an automatic identification method, relying on storing and remotely retrieving data using devices called RFID tags or transponders. Some RFID tags have been used in severe environment of temperature ranged from 200℃ to 250°C for a long time and may cause serious problems such as signal error, short life cycle and explosion. Conventionally, the RFID tags for high temperature applications consisted of Fe-alloy housing part, ceramic powder and RFID sensor. However, it has disadvantage of heavy weight, signal noise and heat shield capability. In this study, we newly applied the aluminum porous materials fabricated by polymer leaching process into RFID tags in order to improve heat shielding ability, and compared the properties of RFID tag inserted by aluminum porous with the conventional one.

Abstract

The RFID (Radio-Frequency Identification) is an automatic identification method, relying on storing and remotely retrieving data using devices called RFID tags or transponders. Some RFID tags have been used in severe environment of temperature ranged from 200℃ to 250°C for a long time and may cause serious problems such as signal error, short life cycle and explosion. Conventionally, the RFID tags for high temperature applications consisted of Fe-alloy housing part, ceramic powder and RFID sensor. However, it has disadvantage of heavy weight, signal noise and heat shield capability. In this study, we newly applied the aluminum porous materials fabricated by polymer leaching process into RFID tags in order to improve heat shielding ability, and compared the properties of RFID tag inserted by aluminum porous with the conventional one.

참고문헌 (7)

  1. H. S. Lee, , Cellmat symp. Proc. Germany, pp.95~ (2010)
  2. J. Langebach, , World Academy of Science Engineering and Technology, 28, pp.341~ (2007)
  3. T. M. Jeng, , IJ HMT, 53, pp.4216~ (2010)
  4. S. H. Cho, , Microelectronics Reliability, 48, pp.1696~ (2008)
  5. I. A. Badruddin, , ICHMT, 33, pp.491~ (2006)
  6. B. V. Antohe, , Int. J. Heat and Fluid Flow, 17, pp.594~ (1996)
  7. P. X. Jiang, , IJHMT, 49, pp.1685~ (2006)

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