휴대폰 키패드의 최적 사출성형 공정 설계
Optimization of injection molding process for plastic keypad on mobile phone
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초록
Deformation frequently occurring in injection molded products is a phenomenon displayed due to uneven shrinkage distribution and orientation of the whole molded product. Shrinkage deformation is a very serious problem because it causes deformation of the molded article and shortens the performance of the product. In this paper, we are focusing on the warpage of keypad in mobile phone. In other words, we focused on minimizing keypad deformation. In the study, the Taguchi method was applied to find the injection molding conditions that minimize the deformation of the keypad. In the case of this keypad, the main factors influencing the shrinkage deformation were predicted as the melting temperature, coolant temperature and cooling time. In addition, the optimum molding conditions were obtained and the shrinkage strain was minimized. Experiments for the Taguchi method and verification of optimal molding conditions were performed using an injection molding analysis program.
Abstract
Deformation frequently occurring in injection molded products is a phenomenon displayed due to uneven shrinkage distribution and orientation of the whole molded product. Shrinkage deformation is a very serious problem because it causes deformation of the molded article and shortens the performance of the product. In this paper, we are focusing on the warpage of keypad in mobile phone. In other words, we focused on minimizing keypad deformation. In the study, the Taguchi method was applied to find the injection molding conditions that minimize the deformation of the keypad. In the case of this keypad, the main factors influencing the shrinkage deformation were predicted as the melting temperature, coolant temperature and cooling time. In addition, the optimum molding conditions were obtained and the shrinkage strain was minimized. Experiments for the Taguchi method and verification of optimal molding conditions were performed using an injection molding analysis program.