전자회로 일체형 돔 형상의 플라스틱 부품 성형에 관한 연구
A study on the molding of dome shaped plastic parts embedded with electronic circuits
0
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
Smart systems in different application areas such as automotive, medical and consumer electronics require anovel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods includingmechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products andcomplicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate adome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film waspredicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In orderto decrease spring-back after thermoforming, the Taguchi method of design of experiment was used . Through ANOVAanalysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis,gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on filmoccurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melttemperature.
Abstract
Smart systems in different application areas such as automotive, medical and consumer electronics require anovel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods includingmechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products andcomplicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate adome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film waspredicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In orderto decrease spring-back after thermoforming, the Taguchi method of design of experiment was used . Through ANOVAanalysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis,gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on filmoccurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melttemperature.
참고문헌 (14)
- Leong, Y.W, "The effect of molding conditions on mechanical and morphological properties at the interface of film insert injection molded polypropylene-film", polypropylene matrix, 2004, pp.44(12), 2327~2334
- Oulu, P. N., "Multilayer structure for accommodating electronics and related method of manufacture", Tacto Tek Oy, US Patent, No. 9724869B2, ~ (2017)
- "In-Mold Electronic Technology"[URL]
- Liu, R. H., "Design of the printing pattern on film for three dimensional molded interconnect devices", Adv Polym Technol, 37(6), pp.1722~1731 (2018)
- Islam, A., "Quality investigation of miniaturized moulded interconnect devices(MIDs)for hearing aid application", Manufacturing Technology, 64(1), pp.539~544 (2015)
- Poller, S., "Film temperatures determine the wall thickness of thermoformed parts", SPE ANTEC, 38(1), pp.104~108 (1992)
- 유영길, "열진공성형 공정조건이 적층필름의 두께분포에 미치는 영향", 소성∙가공, 20(3), pp.250~256 (2011), 한국소성∙가공학회
- 이호상, "열진공성형에서 적층필름 두께변화에 대한 수치 및 실험적 해석", 소성∙가공, 22(3), pp.171~177 (2013), 한국소성∙가공학회
- Lee, J. K., "Effects of rheological properties and processing parameters on ABS thermoforming", Polym. Eng. Sci, 41(2), pp.240~261 (2001)
- 성겸손, "열진공성형에서 발생하는 필름의 두께 분포와 패턴 변형에 관한 연구", Design & Manufacturing, 12(2), pp.5~10 (2018), 한국금형공학회[DOI]
- Hwang, H. S., "A study on a wash-out phenomenon in two-component injection molding", Proc. KSTP Spring Conf, pp.233~237 (2013)
- 손진우, "필름 인서트 인몰드 코팅에서의 워시아웃과 휨 변형에 관한 실험적 연구", 대한기계학회논문집 A, 42(3), pp.213~219 (2018), 대한기계학회
- "Computer Simulations of Transfor -ming and Blowing Molding" (2005)[URL]
- Phadke, M. S., "Quality Engineering using Robust Design" (1992), AT&T Bell Lab., Prentice Hall