유한요소해석을 이용한 백그라인딩 장비의 구조안정성 연구
A study on structural stability of Backgrinding equipment using finite element analysis
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초록
Lately, the development of the semiconductor industry has led to the miniaturization of electronic devices. Therefore, semiconductor wafers of very thin thickness that can be used in Multi-Chip Packages are required. There is active research on the backgrinding process to reduce the thickness of the wafer. The backgrinding process polishes the backside of the wafer, reducing the thickness of the wafer to tens of μm. The equipment that performs the backgrinding process requires ultra-precision. Currently, there is no full auto backgrinding equipment in Korea. Therefore, in this study, ultra-precision backgrinding equipment was designed. In addition, finite element analysis was conducted to verify the equipment design validity. The deflection and structural stability of the backgrinding equipment were analyzed using finite element analysis.
Abstract
Lately, the development of the semiconductor industry has led to the miniaturization of electronic devices. Therefore, semiconductor wafers of very thin thickness that can be used in Multi-Chip Packages are required. There is active research on the backgrinding process to reduce the thickness of the wafer. The backgrinding process polishes the backside of the wafer, reducing the thickness of the wafer to tens of μm. The equipment that performs the backgrinding process requires ultra-precision. Currently, there is no full auto backgrinding equipment in Korea. Therefore, in this study, ultra-precision backgrinding equipment was designed. In addition, finite element analysis was conducted to verify the equipment design validity. The deflection and structural stability of the backgrinding equipment were analyzed using finite element analysis.
참고문헌 (5)
- Gao, S., "Warping of silicon wafers subjected to back-grinding process", Precision Engineering, 40, pp.87~93 (2015)
- Pei, Z. J., "A study on surface grinding of 300 mm silicon wafers", International Journal of Machine Tools and Manufacture, 42(3), pp.385~393 (2002)
- Chen, R., "Mechanical model of single abrasive during chemical mechanical polishing: molecular dynamics simulation", Tribology International, 133, pp.40~46 (2019)
- Seong, H. S., "An equipment Trends and Process Technology for Chemical Mechanical Polishing", The Magazine of the IEIE, 40(12), pp.46~58 (2013)
- 이부윤, "구조해석을 통한 하부냉동실형 빌트인 냉장고 도어의 처짐량 평가", 한국기계가공학회지, 19(2), pp.89~96 (2020), 한국기계가공학회