A Study on the Fault Process and Equipment Analysis of Plastic Ball Grid Array Manufacturing Using Data-Mining Techniques
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The yield and quality of a micromanufacturing process are important management factors. In real-worldsituations, it is difficult to achieve a high yield from a manufacturing process because the products are producedthrough multiple nanoscale manufacturing processes. Therefore, it is necessary to identify the processes andequipment that lead to low yields. This paper proposes an analytical method to identify the processes andequipment that cause a defect in the plastic ball grid array (PBGA) during the manufacturing process usinglogistic regression and stepwise variable selection. The proposed method was tested with the lot trace recordsof a real work site. The records included the sequence of equipment that the lot had passed through and thenumber of faults of each type in the lot. We demonstrated that the test results reflect the real situation in aPBGA manufacturing process, and the major equipment parameters were then controlled to confirm theimprovement in yield; the yield improved by approximately 20%.
Abstract
The yield and quality of a micromanufacturing process are important management factors. In real-worldsituations, it is difficult to achieve a high yield from a manufacturing process because the products are producedthrough multiple nanoscale manufacturing processes. Therefore, it is necessary to identify the processes andequipment that lead to low yields. This paper proposes an analytical method to identify the processes andequipment that cause a defect in the plastic ball grid array (PBGA) during the manufacturing process usinglogistic regression and stepwise variable selection. The proposed method was tested with the lot trace recordsof a real work site. The records included the sequence of equipment that the lot had passed through and thenumber of faults of each type in the lot. We demonstrated that the test results reflect the real situation in aPBGA manufacturing process, and the major equipment parameters were then controlled to confirm theimprovement in yield; the yield improved by approximately 20%.
참고문헌 (10)
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