Investigation of Adhesion Mechanism at the Metal-OrganicInterface Modified by Plasma Part I

Abstract

For the mold die sticking mechanism, the major explanation is that the silica as a filer inEMC (epoxy molding compound) wears die surface to be roughened, which results in increase of adhesionstrength. As the sticking behavior, however, showed strong dependency on the EMC models based onthe experimental results from diferent semiconductor manufacturers, chemisorption or acid-base interac-tion is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implan-tation (PSII) using O2, N2, and CF4 modifies sample surface to form a new dense layer and improve surfacehardness, and change metal surface condition from hydrophilic to hydrophobic or vice versa. Throughsurface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger,major governing mechanism for sticking issue was figured out to be a complex of mechanical and chem-ical factors.