본문 바로가기
KERD
논문KCI 등재

Electroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment

T.H. Song|J.K. Lee|S.Y. Park
한국재료부식학회 (The Corrosion Science Society of Korea)|2005.12|CORROSION SCIENCE AND TECHNOLOGY|제4권 제6호|pp. 222-225

2

조회

0

다운로드

1

인용

0

참고문헌

주제분류금속공학

초록

Abstract

The adhesion strength of metal plating on PC was studied. In this study, surface was treated by chemical agents or DBD(dielectric barrier discharge) plasma to imporve the adhesion. The surface roughness, contact angle, gloss of plating and adhesive strength were measured. Adhesion strengths of Ni plating on prepared PC by NaOH and KOH solution were 12.3 kgf/cm2 and 7.5 kgf/cm2, respectively. The highest adhesion strength was obtained in the plasma treated one, 27.8 kgf/cm2.

참고문헌 (5)

  1. "Properties and Applications of Polycarbonate", pp.432~438 (1993)
  2. "pH Effects of Electroless Ni Plating on ABS Plastics", 3(1), pp.26~29 (2004)
  3. "Effects of different laser and plasma treatments on the interface and adhesion between evaporated aluminium and polyethylene terephthalate films", pp.304~318 (2005)
  4. "Etching Characteristics for Tracks of Carbon Cluster Ions in Polycarbonate", pp.621~626 (2004)
  5. "Effects of pH Variation on the Properties of Electroless Nickel Plating on ABS Made by MmSH", 5(5), pp.433~437 (2004)

관련 논문AI추천

Plasma Aided Process As Alternative to Hard Chromium ElectroplatingD.Kim, D-YChang, G-HLee, J-KKim, K-HLee, K-SNam, M.Kim, SikCholKwon한국표면공학회 · 한국표면공학회지2003 · 제36권 제1호pH Effects of Electroless Ni Plating on ABS PlasticsJ.k. Lee, K.K. Ryoo, T.H. Song, Y.B. Lee한국재료부식학회 · CORROSION SCIENCE AND TECHNOLOGY2004 · 제3권 제1호불소수지의 무전해 동도금을 위한 단계적 플라즈마 전처리법에 관한 연구김영석, 신승한, 한성호한국표면공학회 · 한국표면공학회지2005 · 제37권 제3호Improvement of Plating Characteristics Between Nickel and PEEK by Plasma Treatment and Chemical Etching박기용, 이종권, 이혜원한국재료부식학회 · CORROSION SCIENCE AND TECHNOLOGY2009 · 제8권 제1호Electroless Copper Plating for Metallization of Electronic DevicesJae-Ho Lee한국마이크로전자및패키징학회 · 마이크로전자 및 패키징학회지2004 · 제11권 제4호무전해 Ni-P 도금의 공정조건에 따른 도금피막 특성변화박해덕, 이홍기, 전준미한국표면공학회 · 한국표면공학회지2003 · 제36권 제3호

이 간행물의 다른 논문 (5건)

Anodization of Aluminium Samples in Boric Acid Solutions by Optical Interferometry TechniquesK.Habibpp. 217-221Effect of Si Addition on the Corrosion Resistance of Diamond-Like Carbon (DLC) Films이광렬, 김정구, 박세준, Woo-Jung Kimpp. 226-230Investigation of some Natural Product Extracts as Corrosion Inhibitors for Mild Steel in Acid MediuT. Vasudevan, A.J. Abdul Nasser, S. Saravanan, A.R. Sathiya Priya, A. Subramaniapp. 231-235Effect of H2S Partial Pressure and pH of Test Solution on Hydrogen Induced Cracking of High Strength Low Alloy SteelsHwan Kyo Jung, Boo Young Yang, Seong Ung Koh, Kyoo Young Kim, Wan Keun Kimpp. 236-241Influences of Cathodic Protection and Coating Properties on the Corrosion Control of Metallic Structure in Extremely Acidic Fluids김영식, Y. R. Yoo, T. E. Jin, H. Y. Changpp. 242-249
원문 보기