공정조성SnPb 솔더에 대한 실시간 Electromigration 거동 관찰
In-situ Observation of Electromigration Behaviors of Eutectic SnPb Line
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초록
공정조성의 SnPb 솔더 선형시편에서 electromigration 현상을 실시간 주사전자현미경을 이용하여 관찰하였다. 공정조성 SnPb솔더시편에 대한 electromigration실험은 전류밀도6×104A/cm2, 90℃에서 실시하였다. 주사전자현미경 챔버 내에서 진행되는electromigration 실험 동안 음극의 보이드 형성과 양극의 힐록 성장을 실시간으로 관찰하였다. 음극에서 일어나는 보이드 크기를 실시간 관찰한 결과, 공정조성 SnPb솔더의 electromigration 거동은 보이드 형성 전에 가지는 잠복기의 존재를 명확히 알 수 있었고, 본 결과는 electromigration 거동으로 인한 플립칩 솔더 범프의 보이드 생성에 대한 잠복기와 관련이 있었다.
Abstract
: In-situ electromigration test was carried out for edge drift lines of eutectic SnPb solder using Scanning Electron Microscopy (SEM). The electromigration test for the eutectic SnPb solder sample was conducted at temperature of 90C and the current density of 6×104A/cm2. Edge drift at cathode and hillock growth at anode were observed in-situ in a SEM chamber during electromigration test. It was clearly revealed that eutectic SnPb solder lines has an incubation stage before void formation during electromigration test, which seemed to be related to the void nucleation stage of flip chip solder electromigration behaviors.
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