63Sn-37Pb 솔더 스트립에서의 Electromigration 거동
Electromigration Behavior in the 63Sn-37Pb Solder Strip
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초록
63Sn-37Pb 공정솔더의 electromigration 현상을 용이하게 관찰하기 위해 63Sn-37Pb 공정솔더를 증착하여 스트립 형태의 시편을 제작 후 electromigration 테스트를 실시하였다. 80~150oC의 온도 및 1´104~1´105 A/cm2의 전류밀도에서 electromigration 테스트시 스트립 형상의 63Sn-37Pb 솔더 합금에서 hillock과 void의 발생이 관찰되었으며, 온도와 전류밀도가 높아질수록 void의 형성이 빨라져서 평균파괴시간이 단축되었다. 평균파괴시간을 이용하여 Black의 식으로부터 구한 63Sn-37Pb 솔더 스트립의 electromigration에 대한 활성화 에너지는 0.16~0.5 eV이었다.
Abstract
To facilitate the observation of the electromigration of 63Sn-37Pb eutectic solder, strip-type samples were fabricated by solder evaporation. The electromigration test for the 63Sn-37Pb solder strip was conducted at temperatures of 80~150C and the current densities of 110~110 A/cm. With increasing temperature and the current density, mean-time-to-failure(MTTF) decreased due to the formation of hillock and void in the solder strip. The activation energy for the electromigration in the 63Sn-37Pb solder strip was analyzed as 0.16~0.5 eV using Black's equation.
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