Sn-1.8Bi-0.7Cu-0.6In 솔더의 고온 시효 특성
Aging Characteristics of Sn-1.8Bi-0.7Cu-0.6In Solder
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초록
새로 개발된 Sn-1.8Bi-0.8Cu-0.6In 솔더의 리플로우 후 고온시효 특성을 전당강도 및 미세구조 분석을 통하여 평가하였다. 범프 형성을 위하여 스텐실 프린트법을 사용하였다. Sn-1.8Bi- 0.8Cu-0.6In솔더의 전단강도가 초기 및 고온시효 후에도 가장 높았고, 생성된 계면 금속간화합물은 리플로우 초기 뿐만 아니라 시효 후 동일 하게 (Cu, Ni)6Sn5가 형성되었다. 또한, 500시간 시효 이전에 솔더의 분리 현상이 관찰 되었다.
Abstract
Aging characteristics of newly developed Sn-1.8Bi-0.8Cu-.06In solder was evaluated by shear strength and microstructure. Stencil printing was applied to form solder. The shear strength of Sn-1.8Bi-0.8Cu-0.6In at 150C showed the highest values through aging. Intermetallic compounds formed on the interface between solder and Au/Cu/Ni/Al UBM were (Cu,Ni)6Sn5. Furthermore, it was found that Spalling of Intermetallic compounds started before 500h aging at 150℃.
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