CMOS 이미지 센서용 Au 플립칩 범프의 초음파 접합
Ultrasonic Bonding of Au Flip Chip Bump for CMOS Image Sensor
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초록
본 연구의 목적은 CMOS 이미지 센서용 Au 플립칩 범프와 전해 도금된 Au 기판 사이의 초음파 접합의 가능성 연구이다. 초음파 접합 조건을 최적화하기 위해서, 대기압 플라즈마 세정 후 접합 압력과 시간을 달리하여 초음파 접합 후 전단 시험을 실시하였다. 범프의 접합 강도는 접합 압력과 시간 변수에 크게 좌우되었다. Au 플립칩 범프는 상온에서 성공적으로 하부 Au 도금 기판과 접합되었으며, 최적 조건 하에서 접합 강도는 약 73 MPa이었다.
Abstract
: This study was focused on the feasibility of ultrasonic bonding of Au flip chip bumps for a practical complementary metal oxide semiconductor (CMOS) image sensor and the electroplated Au substrate. The ultrasonic bonding was carried out with different bonding pressures and times after the atmospheric pressure plasma cleaning, and then the die shear test was performed to optimize the ultrasonic bonding parameters. The bonding pressure and time strongly affected the bonding strength of the bumps. The Au flip chip bumps were successfully bonded with the electroplated Au substrate at room temperature, and the bonding strength reached approximate 73 MPa under the optimum conditions.
참고문헌 (11)
- "휴대폰용 카메라 모듈", pp.1~7 (2004), 전자정보센터
- "차량용 카메라 기술 동향", pp.1~14 (2006), 전자정보센터
- "Flip-chip packaging solution for CMOS image sensor deviceFlip-chip packaging solution for CMOS image sensor device", 44, pp.155~ (2004)
- "Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test", 5, pp.124~126 (2007)
- "Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni Under Bump Metallization during Multiple Reflows", 181 (2006)
- "Development of Ultrasonic Flip Chip Bonding for Flexible Printed Circuit", 307 (2004)
- "Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20m Pitch", 42, pp.2198~ (2003)
- "Enhance-ment of Adhesion Strength between Two AISI 316L Stainless Steel Plates through Atmospheric Pressure Plasma Treatment", 200, pp.5220~ (2005)
- "Surface Treatment of Metals Using an Atmospheric Pressure Plasma Jet and Their Surface Characteristics", pp.174~175 (2003)
- "Development of Gold to Gold Interconnection Flip Chip Bonding for Chip on Suspension Assemblies", 42, pp.381~ (2002)
- "Fundamentals of Materials Science and Engineering", pp.282~303 (2005), John Wiley & Sons, New-York