Development of Wafer Bond Integrity Inspection System Based on Laser Transmittance
0
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.
Abstract
Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.
참고문헌 (20)
- S. T. Jung, "A Study on the Inner Defect Inspection for Semiconductor Package by ESPI", Proc. KSME Fall conference, Muju Resort, pp.1442~ (2003), The Korean Society of Mechanical Engineering
- W. Chegal, "Measurement of Thin Film Thickness of Patterned Samples Using Spectral Imaging Ellipsometry", Korean Society Of Precision Engineering, 21(6), pp.12~ (2004)
- S. J. Nam, "Implementation of Automated Defect Detection and Classification System for Semiconductor Wafers", The Korean Institute of Information Scientists and Engineers, 28(2), pp.334~ (2001)
- A. R. Burgers, "Light-trapping in Saw-damage Etched Silicon Wafers", ECN Solar Energy, 97(2), pp.30~ (1997)
- J. Zhao, "Optimized Anti-reflection Coatings for High-Efficiency Silicon Cells", IEEE T. Electron. Dev., 38(8), pp.1925~ (1991)
- J. Hofstetter, "Optimization of SiNx:H Anti-reflection Coatings for Silicon Solar Cells", Spanish Conference on Electron Devices, 10(1109), pp.131~ (2007)
- W. D. Kelton, "Experimental Design for Simulation", Winter Simulation Conference, 1(1), pp.32~ (2000)
- T. C. Urdan, "Statistics in Plain English, 2nd Ed", pp.17~ (2005), Lawrence Erlbaum Associates Publishers
- J. K. Telford, "A Brief Introduction to Design of Experiments", Johns Hopkins APL Technical Digest, 27(3), pp.224~ (2007)
- Z. Sun, "Research of Diffusing Plates for LCD Backlights", Optik-International Journal for Light and Electron Optics, 121(8), pp.760~ (2010)
- J. W. Park, "LuminanceUniformity of Large-Area OLEDs With an Auxiliary Metal Electrode", Journal of Display Technology, 5(8), pp.306~ (2009)
- 류장렬, "Back Light Unit 내부의 LED Back light의 광균일도를 향상시키기 위한 LED 배열 방식의 비교 분석", 한국정보기술학회논문지, 7(1), pp.1~8 (2009), 한국정보기술학회
- A. A. Ayon, "Characterization of Silicon Wafer Bonding for Power MEMS Applications", Sensors. Actuat., 101(1), pp.1~ (2003)
- M. S. Kim, "Optical Measurement Using Laser Speckle Inferometry", Journal of the Korean Society for Precision Engineering, 24(11), pp.38~ (2007)
- T. Iwai, "Speckle Reduction in Coherent Information Processing", Proceedings of the IEEE, 84(5), pp.766~ (1996)
- J. W. Goodman, "Speckle Phenomena in Optics: Theory and Applications", pp.141~186 (2007), Roberts & Company Publishers
- K. Hinkelmann, "Design and Analysis of Experiments: Introduction to Experimental Design", pp.45~70 (2005), John Wiley & Sons Inc
- Qian Wang, "Au-Sn 공정 접합을 이용한 RF MEMS 소자의 Hermetic 웨이퍼 레벨 패키징", 마이크로전자 및 패키징학회지, 12(3), pp.197~206 (2005), 한국마이크로전자및패키징학회
- 박재현, "폴리머를 이용한 CIS(CMOS Image Sensor) 디바이스용 웨이퍼 레벨 접합의 warpage와 신뢰성", 마이크로전자 및 패키징학회지, 16(1), pp.27~31 (2009), 한국마이크로전자및패키징학회
- 김정모, "초음파를 이용한 Sn-3.5Ag 플립칩접합부의 신뢰성 평가- Si웨이퍼와 Sn-3.5Ag 솔더의 접합 계면 특성 연구", 마이크로전자 및 패키징학회지, 13(1), pp.23~30 (2006), 한국마이크로전자및패키징학회