전자패키지 신뢰성 평가기술의 개요
Introduction of Reliability Test Technology for Electronics Package
1
조회
0
다운로드
7
인용
0
참고문헌
키워드
초록
Reliability technology has been expected to grow rapidly for new types of electronic equipments. We have selected several reliability issues in electronic package to be reviewed. This paper will provide a view of the current state of technological progress in reliability of electronic package in Japan, and will discuss future prospects for the technology.
Abstract
Reliability technology has been expected to grow rapidly for new types of electronic equipments. We have selected several reliability issues in electronic package to be reviewed. This paper will provide a view of the current state of technological progress in reliability of electronic package in Japan, and will discuss future prospects for the technology.
참고문헌 (16)
- "Japan Society of Mechanical Engineers"[URL]
- "Japan Institute of Electronics Packaging"[URL]
- D. P. Seraphim, "Principles of Electronic Packaging" (1989), McGraw-Hill
- 이기주, "플립칩 패키지에서의 일렉트로마이그레이션 현상", 마이크로전자 및 패키징학회지, 17(4), pp.11~17 (2010), 한국마이크로전자및패키징학회
- Japan Electronics & Information Technology Industries Association, "EIAJ-EDR-4704, Application Guide of the Accelerated Life Test for Semiconductor Device", ~ (2000)
- N. Lycoudes, "Pressure Temperature Humidity Bias Method and System for Corrosion Studies of Plastic Encapsulated Integrated Circuit", Proc. 23rd Annual Technical Meeting of the Institute of Environmental Sciences (1977), Institute of Environmental Sciences
- Japan Electronics & Information Technology Industries Association, "JEITA-ET-7407, Environmental and Endurance Test Methods for a CSP", BGA Package Mounting Condition, 1999
- H. Tanaka, "Actual Conditions and Challenges of Accelerated Test", Journal of Japan Institute of Electronics Packaging, 13(7), pp.502~ (2010)
- R. Kawanaka, "Materials Accidents and Material Technology", Proc. 21st Reliability Symposium (2008), Reliability Engineering Association of Japan
- F. Harada, "An Issue and Foresight for Accelerated Test in Reliability Engineering", Journal of Reliability Engineering Association of Japan, 31(2), pp.101~ (2009)
- "IPC-SM-785, Guidelines for Accelerated Reliability Testing for Surface Mount Solder Attachments", 13~ (1992)
- "IEC-60749-25, Semiconductor devices–Mechanical and climatic test methods–Part 25:Temperature cycling", ~ (2003)
- H. Tanaka, "Reliability Testing Technique of Isotropically Conductive Adhesive Jisso", Journal of Japan Institute of Electronics Packaging, 11(3), pp.231~ (2008)
- 김근수, "도전성접착제", Sn도금의 계면특성에 미치는 Cl의 영향, 2011, pp.18(3), 33~37[DOI]
- Evaluating the CAF (Conductive Anodic Filament) Resistance of Multi-layered PWBs, "A. Kobayashi", ~, pp.ESPEC Technology Report, 24, 3 (2006)