SnBi 저온솔더의 플립칩 본딩을 이용한 스마트 의류용 칩 접속공정
Chip Interconnection Process for Smart Fabrics Using Flip-chip Bonding of SnBi Solder
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초록
SnBi 저온솔더의 플립칩 공정을 이용한 스마트 의류용 칩 접속공정에 대해 연구하였다. 캐리어 필름에 형성한 Cu 리드프레임을 130oC에서 직물에 열압착 시킴으로써 Cu 리드프레임이 전사된 직물 기판을 형성하였다. 칩 시편에SnBi 페이스트를 도포하여 솔더범프를 형성한 후 직물 기판의 Cu 리드프레임에 배열하고 180oC에서 60초 동안 유지시켜 플립칩 본딩하였다. SnBi 저온솔더를 사용하여 형성된 스마트 의류용 플립칩 접속부의 평균 접속저항은 9 mΩ이었다.
Abstract
A chip interconnection technology for smart fabrics was investigated by using flip-chip bonding of SnBi lowtemperature solder. A fabric substrate with a Cu leadframe could be successfully fabricated with transferring a Cu leadframe from a carrier film to a fabric by hot-pressing at 130oC. A chip specimen with SnBi solder bumps was formed by screen printing of SnBi solder paste and was connected to the Cu leadframe of the fabric substrate by flip-chip bonding at 180oC for 60 sec. The average contact resistance of the SnBi flip-chip joint of the smart fabric was measured as 9 mΩ.
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