Sn 휘스커 연구동향

키워드

참고문헌 (23)

1. "The RoHS Regulation (Directive 2002/95/EC)"[URL]
2. J. Bath, "Research Update: Lead Free Solder Alternative", Circuit Assembly, 11(5), pp.30~ (2000)
3. Japan Electronics and Information Technology Industries Association, "Guideline for Selection of Lead-Free Materials for Tin-Whisker Mitigation", ~ (2010)
4. Pbfree Electronics Research Manhattan Project, "Benchmarking and Best Practices Center of Excellence", ACI Technologies Inc, ~ (2009)
5. "K. Suganuma", ~, pp.Uyemura Technical Reports, 62, 3 (2007)
6. H. Leidecker, "Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin Whisker and Discussion of Investigative Techniques Used for Whisker Detection", Proc. 5th International Symposium on Tin Whisker (2011)
7. A. Telang, "Characterization of Microstructure and Crystal Orientation of the Tin Phase in Single Shear Lap Sn?3.5Ag Solder Joint Specimens", Scripta Materialia, 52(10), pp.1027~ (2005)
8. J. Rayne, "Elastic Constants of β Tin from 4.2oK to 300oK", Physical Review, 120(5), pp.1658~ (1960)
9. H. Huntington, "The Elastic Constants of Crystals", Solid State Physics, 7, pp.213~ (1958)
10. D. House, "Determination of the Elastic Moduli of Tin Single Crystals, and Their Variation with Temperature", British Journal of Applied Physics, 11(6), pp.254~ (1960)
11. J. W. Osenbach, "Sn Whiskers: Material, Design, Processing, and Post-plate Reflow Effects and Development of an Overall Phenomenological Theory", IEEE Transactions on Electronics Packaging Manufacturing, 28(1), pp.36~ (2005)
12. W. J. Boettinger, "Whisker and Hillock Formation on Sn, Sn?Cu and Sn?Pb Electrodeposits", Acta Materialia, 53(19), pp.5033~ (2005)
13. K. N. Tu, "Spontaneous Whisker Growth on Lead-Free Solder Finishes", Materials Science and Engineering: A, 409(1), pp.131~ (2005)
14. A. Baated, "Whisker Growth Behavior of Sn and Sn Alloy Lead- Free Finishes", Journal of Electronic Materials, 40(11), pp.2278~ (2011)
15. A. Baated, "Effect of Intermetallic Growth Rate on Spontaneous Whisker Growth from a Tin Coating on Copper", Journal of Materials Science: Materials in Electronics, 22, pp.1685~ (2011)
16. 김경섭, "Effects of Heat Treatment on the Microstructure and Whisker Growth Propensity of Matte Tin Finish", 마이크로전자 및 패키징학회지, 17(2), pp.11~20 (2010), 한국마이크로전자및패키징학회
17. 김경섭, "무연솔더 도금된 리드프레임에서 Sn 위스커의 성장과 구조", 마이크로전자 및 패키징학회지, 11(3), pp.1~7 (2004), 한국마이크로전자및패키징학회
18. 오철민, "주석 휘스커 성장 메카니즘 및 억제방안", 대한용접접합학회지, 29(4), pp.365~372 (2011), 대한용접접합학회
19. N. Nemoto, "宇宙分野におけるソルダリング技術の取り組み", 日本溶接學會, (46) (2008), マイクロ接合硏究委員會
20. "JAXA Special Publication (In Japanese)" (2008)[URL]
21. N. Nemoto, "Tin Whisker Evaluation Status for Space Application", Proc. 4th International Symposium on Tin Whisker (2010)
22. K. Suganuma, "Sn Whisker Growth during Thermal Cycling", Acta Materialia, 59(19), pp.7255~ (2011)
23. Government Electronics and Information Technology Association, "Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts", ~ (2008)

관련 논문AI추천