신축성 전자패키지용 강성도 국부변환 신축기판의 계면접착력 향상공정
Interfacial Adhesion Enhancement Process of Local Stiffness-variant Stretchable Substrates for Stretchable Electronic Packages
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초록
강성도가 서로 다른 두 polydimethylsiloxane (PDMS) 탄성고분자와 flexible printed circuit board (FPCB)로이루어진 soft PDMS/hard PDMS/FPCB 구조의 강성도 국부변환 신축기판을 개발하기 위해 PDMS와 FPCB를 acrylicsilicone 양면테이프를 사용하여 접합한 후 접합공정에 따른 PDMS/FPCB 계면접착력을 분석하였다. 완전 경화된 PDMS 에 acrylic-silicone 양면테이프의 silicone 접착제로 접착한 FPCB의 pull 강도는 259 kPa이었으며, pull 시험시 PDMS와silicone 접착제 사이에서 박리가 발생하였다. 반면에 60oC에서 15~20분 유지하여 반경화시킨 PDMS에 acrylic-silicone 양면테이프의 silicone 접착제로 FPCB를 접착 후 60oC에서 12시간 유지하여 PDMS를 완전 경화시키면 pull 강도가1,007~1,094 kPa로 크게 향상되었으며, pull 시험시 계면 박리가 acrylic-silicone 양면테이프의 acrylic 접착제와 FPCB 사이에서 발생하였다.
Abstract
In order to develop a local stiffness-variant stretchable substrate with the soft PDMS/hard PDMS/FPCB configuration consisting of two stiffness-different polydimethylsiloxane (PDMS) parts and flexible printed circuit board, a FPCB was bonded to PDMS using the acrylic-silicone double-sided tape and the interfacial adhesion of the PDMS/ FPCB was evaluated. The pull strength of the FPCB, which was bonded to the fully cured PDMS using the silicone adhesive of the double-sided tape, was 259 kPa and the delamination during the pull test occurred at the interface between the PDMS and the silicone adhesive. On the contrary, the bonding process, for which the FPCB was bonded using the silicone adhesive to the PDMS partially cured for 15~20 minutes at 60oC and then the PDMS was fully cured for 12 hours at 60oC, exhibited the remarkably enhanced pull strength of 1,007~1,094 kPa. With the above mentioned bonding process, the delamination during the pull test was observed at the interface between the FPCB and the acrylic adhesive of the acrylic-silicone double sided tape.
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