신축성 전자패키지용 강성도 국부변환 신축기판에서의 플립칩 공정
Flip Chip Process on the Local Stiffness-variant Stretchable Substrate for Stretchable Electronic Packages
0
조회
0
다운로드
5
인용
0
참고문헌
키워드
초록
강성도가 서로 다른 polydimethylsiloxane (PDMS) 탄성고분자와 flexible printed circuit board (FPCB)로 이루어진 PDMS/FPCB 구조의 강성도 국부변환 신축기판에 100 μm 직경의 Cu/Au 범프를 갖는 Si 칩을 anisotropic conductive adhesive (ACA)를 사용하여 플립칩 본딩 후, ACA내 전도성 입자에 따른 플립칩 접속저항을 비교하였다. Au 코팅된 폴리머 볼을 함유한 ACA를 사용하여 플립칩 본딩한 시편은 43.2 mΩ의 접속저항을 나타내었으며, SnBi 솔더입자를 함유한 ACA로 플립칩 본딩한 시편은 36.2 mΩ의 접속저항을 나타내었다. 반면에 Ni 입자를 함유한 ACA를 사용하여 플립칩 본딩한 시편에서는 전기적 open이 발생하였는데, 이는 ACA내 Ni 입자의 함유량이 부족하여 entrap된 Ni 입자가 하나도 없는 플립칩 접속부가 발생하였기 때문이다.
Abstract
A Si chip with the Cu/Au bumps of 100-μm diameter was flip-chip bonded using different anisotropic conductive adhesives (ACAs) onto the local stiffness-variant stretchable substrate consisting of polydimethylsiloxane (PDMS) and flexible printed circuit board (FPCB). The average contact resistances of the flip-chip joints processed with ACAs containing different conductive particles were evaluated and compared. The specimen, which was flip-chip bonded using the ACA with Au-coated polymer balls as conductive particles, exhibited a contact resistance of 43.2 mΩ. The contact resistance of the Si chip, which was flip-chip processed with the ACA containing SnBi solder particles, was measured as 36.2 mΩ, On the contrary, an electric open occurred for the sample bonded using the ACA with Ni particles, which was attributed to the formation of flip-chip joints without any entrapped Ni particles because of the least amount of Ni particles in the ACA.
참고문헌 (22)
- 오현아, "섬(Island) 구조로 이루어진 강성도 국부변환 신축성 기판의 변형 거동", 마이크로전자 및 패키징학회지, 22(4), pp.117~123 (2015), 한국마이크로전자및패키징학회
- 오현아, "신축성 전자패키징용 강성도 국부변환 polydimethylsiloxane 기판의 탄성계수", 마이크로전자 및 패키징학회지, 22(4), pp.91~98 (2015), 한국마이크로전자및패키징학회
- 최정열, "웨어러블 패키징용 Polydimethylsiloxane (PDMS) 신축성 기판의 강성도 변화거동", 마이크로전자 및 패키징학회지, 21(4), pp.125~131 (2014), 한국마이크로전자및패키징학회[DOI]
- 최정열, "신축성 전자패키징을 위한 CNT-Ag 복합패드에서의 플립칩 공정", 마이크로전자 및 패키징학회지, 20(4), pp.17~23 (2013), 한국마이크로전자및패키징학회[DOI]
- M. Gonzalez, "Thermo-Mechanical Analysis of Flexible and Stretchable Systems", Proc. 11th International Conference of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (Euro-SimE), pp.1~ (2010), Institute of Electrical and Electronics Engineers
- 안종현, "유연 반도체", 메모리 소자 기술, 2013, pp.20(2), 1~9[DOI]
- J. Xiao, "Stretchable and Compressible Thin Films of Stiff Materials on Compliant Wavy Substrates", App. Phys. Lett, 93, pp.013109~ (2008)
- T. Löher, "Stretchable Electronic Systems", Proc. 59th Electronic Components and Technology Conference (ECTC), pp.893~ (2009), IEEE Components, Packaging and Manufacturing Technology Society
- T. Sekitani, "A Rubberlike Stretchable Active Matrix Using Elastic Conductors", Science, 321, pp.1468~ (2008)
- D. H. Kim, "Stretchable and Foldable Silicon Integrated Circuits", Science, 320, pp.507~ (2008)
- M. Gonzalez, "Design of Metal Interconnects for Stretchable Electronic Circuits", Microelectron. Reliab, 48, pp.825~ (2008)
- T. Sekitani, "Stretchable Active-Matrix Organic Light-Emitting Diode Display Using Printable Elastic Conductors", Nature Mater, 8, pp.494~ (2009)
- J. H. Ahn, "Stretchable Electronics: Materials, Architectures and Integrations", J. Phys. D: Appl. Phys, 45, pp.102001~ (2012)
- D. H. Kim, "Stretchable Electronics: Materials Strategies and Devices", Adv. Mater, 20, pp.4887~ (2008)
- 최정열, "SnBi 저온솔더의 플립칩 본딩을 이용한 스마트 의류용 칩 접속공정", 마이크로전자 및 패키징학회지, 19(3), pp.71~76 (2012), 한국마이크로전자및패키징학회[DOI]
- 박동현, "신축성 전자패키지용 강성도 국부변환 신축기판의 계면접착력 향상공정", 마이크로전자 및 패키징학회지, 25(4), pp.111~118 (2018), 한국마이크로전자및패키징학회
- C. R. Barrett, "The Principles of Engineering Materials", pp.316~325 (1973), Prentice Hall, Inc
- S. Popovics, "Quantitative Deformation Model for Two-phase Composites Including Concrete", Mater. Struct, 20, pp.171~ (1987)
- S. Popovics, "Estimation of the Modulus of Elasticity of Concrete-like Composite Materials", Mater. Struct, 3, pp.253~ (1970)
- D. Park, "Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates", Mater. Trans, 58(8), pp.1217~ (2017)
- D. Park, "Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part I. Flip-Chip Bonding on Rigid Substrates", Mater. Trans, 58(8), pp.1212~ (2017)
- J. Y. Choi, "Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications", Mater. Trans, 56(10), pp.1711~ (2015)